MA4FCP300 Silicon Flip Chip PIN Diode

M/A-COM’s MA4FCP consists of Silicon Flip Chip PIN diodes fabricated with M/A-COM’s patented HMIC process. This diode is fabricated on epitaxial wafers using a process designed for repeatable electrical characteristics and extremely low parasitics. This diode is fully passivated with Silicon Nitride and has an additional layer of Polyimide for scratch protection. These protective coatings prevent damage to the junction during automated or manual handling. This flip chip configuration is suitable for pick and place insertion.

技术特性 Features

Lower Resistance : 2.6 Ω
Lower Capacitance : 40 fF
Faster Switching Speed : 40 nS
Silicon Nitride Reliability Passivation
Polyimide Scratch Protection
Designed for Automated Pick and Place Insertion
Rugged by Design

订购信息 Ordering Information

MA4FCP300 Die in Gel Pack
MA4FCP300-W Wafer Cut on Tape

应用领域Applications

The small 0315 outline and low 0.12 pS RC product,make the device useful for multi-throw switch and switched phase shifter circuits requiring < 40 nS switching speeds up to 18 GHz operating frequency.

应用技术支持与电子电路设计开发资源下载	版本信息	大小
MA4FCP300 数据资料DataSheet下载.pdf	Rev.V2	2 页