A PIN diode-shunt switch element with a unique integrated thermal terminal for dissipating heat in the diode created by the DC and RF input power. The thermal terminal allows for optimum heat dissipation by providing a direct thermal connection between the diode and the circuit heatsink while also being electrically isolated. The chip is designed to provide a heat transfer conduit that does not interfere with the PIN diode anode (input) and cathode (output) electrical terminals, especially with respect to RF performance. The chip is fabricated using M/A-COM Technology Solutions patented HMIC™ process and features silicon pedestals embedded in a low loss, low dispersion glass for low leakage current. The topside is fully encapsulated with silicon nitride and has an additional polymer layer to protect against damage during handling and assembly.
技术特性 Features
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应用领域 ApplicationsThis PIN diode-shunt switch element is particularly advantageous in high average power, 50W, switch applications from 30MHZ – 3GHz. The backside RF, D.C., and thermal I/O ports allow for direct solder re-flow, surface mount, attachment to a micro-strip circuit assembly. The thermal terminal design provides the, power dissipating, diode a direct connection to the circuit thermal ground for unprecedented heat transfer. The thermal terminal port is electrically isolated from the I/O ports and can be configured as either a reflective or an absorptive switch. 订购信息 Ordering Information
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| 应用技术支持与电子电路设计开发资源下载 | 版本信息 | 大小 |
| MASW-001150-1316 数据资料DataSheet下载：PDF | Rev.V2 | 2 页 |
| MASW-001150-1316:S 参数 | 10K |
