MASW-004240-13170W HMIC™ SP4T Surface Mount Silicon PIN Diode Switch with Integrated Bias Network

The MASW-004240-13170W is a surface mount SP4T switch chip with integrated bias network. It utilizes M/A-COM technology Solutions HMICTM (Heterolithic Microwave Integrated Circuit) process, US Patent 5,268,310, which allows the incorporation of silicon pedestals that form and shunt diodes or vias by imbedding them in low loss, low dispersion glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high isolation performance with exceptional repeatability through low millimeter frequencies. Patterned gold backside metal allows for manual or re-flow soldering without the need for wire bond connections to the RF and bias ports. The chip may be soldered using 80Au/20Sn, RoHS compliant solders or electrically conductive silver epoxy. The RF bond pads are labeled J1-J5 and are 375x375μM (15x15mils) square. The DC bias bond pads are labeled B2-B5 and are also 375x375μM (15x15mils) square.

技术特性 Features
  • Operating Freq. 10 ± 2GHz or 24 ± 2GHz
  • Surface Mount Device
  • Integrated Bias Network
  • No Wire Bonds Required
  • Low Current Consumption
    +12 mA for On State/0V for Off Condition
  • Rugged, Glass Encapsulated Construction
  • Fully Monolithic
  • Polymer Scratch Protection
  • RoHS Compliant
应用领域 Applications

The MASW-004240-13170W has been designed for 24GHz automotive radar sensor applications and is also ideally suited for use at 10GHz. The switch is turned on by applying a forward current of +12mA at 4V to the appropriate bias port and is turned off at 0V. The RF bias network has been incorporated into the design for ease of use and space considerations.

订购信息 Ordering Information
  • MASW-004240-13170W Waffle Pack

应用技术支持与电子电路设计开发资源下载 版本信息 大小
MASW-004240-13170W 数据资料DataSheet下载:PDF Rev.V2 2 页