技术特性

• Low Forward Voltage
• Lead Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds
• Low Power Loss/High Efficiency
• Epoxy Meets UL94, VO at 1/8
• 150 °C Operating Junction Temperature
• Case: Epoxy, Molded
• Low Stored Charge Majority Carrier Conduction
  Mechanical Characteristics:
• Weight: 1.9 grams (approximately)
• High Surge Capacity Guard-Ring for Stress Protection
• Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
• All Packages are Pb-Free
• AEC-Q101 Qualified and PPAP Capable
• NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

封装图 PACKAGE DIMENSIONS