技术特性

• Low Forward Voltage
  
• Low Power Loss/High Efficiency
  
• High Surge Capability
  
• 40 A Total (20 A Per Diode Leg)
  
• Guard−Ring for Stress Protection
  
• This is a Pb−Free Device
  Mechanical Characteristics:
  
• Case: Epoxy, Molded
  
• Epoxy Meets UL 94 V−0 @ 0.125 in
  
• Weight (Approximately): 1.9 Grams
  
• Finish: All External Surfaces Corrosion Resistant and Terminal
  Leads are Readily Solderable
  
• Lead Temperature for Soldering Purposes:260°C Max. for 10 Seconds

应用

• Power Supply - Output Rectification
• Power Management
• Instrumentation

封装图 PACKAGE DIMENSIONS