技术特性

• Dual Diode Construction, May be Paralleled for Higher Current Output
  
• Guard−Ring for Stress Protection
  
• Low Forward Voltage Drop
  
• 125C Operating Junction Temperature
  
• Maximum Die Size
  
• Short Heat Sink Tab Manufactured − Not Sheared!
  
• AEC−Q101 Qualified and PPAP Capable
  
• NRVBB Prefix for Automotive and Other Applications Requiring
  Unique Site and Control Change Requirements
  
• All Packages are Pb−Free*
  Mechanical Characteristics
  
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
  
• Weight: 1.7 Grams (Approximately)
  
• Finish: All External Surfaces Corrosion Resistant and Terminal
  Leads are Readily Solderable
  
• Lead and Mounting Surface Temperature for Soldering Purposes:
  260C Max. for 10 Seconds
  
• Device Meets MSL1 Requirements
  
• ESD Ratings:
   Machine Model = C (> 400 V)
   Human Body Model = 3B (> 8000 V)

封装图 PACKAGE DIMENSIONS