技术特性

• Highly Stable Oxide Passivated Junction
  
• Very Low Forward Voltage Drop
  
• Matched Dual Die Construction
  
• High Junction Temperature Capability
  
• High dv/dt Capability
  
• Excellent Ability to Withstand Reverse Avalanche Energy Transients
  
• Guardring for Stress Protection
  
• Epoxy Meets UL 94 V−0 @ 0.125 in
  
• Electrically Isolated. No Isolation Hardware Required.
  
• These are Pb−Free Devices
  Mechanical Characteristics:
  
• Case: Epoxy, Molded
  
• Weight: 1.9 Grams (Approximately)
  
• Finish: All External Surfaces Corrosion Resistant and Terminal
  Leads are Readily Solderable
  
• Lead Temperature for Soldering Purposes:
  260°C Max. for 10 Seconds

封装图 PACKAGE DIMENSIONS