技术特性

• Offers an Ultra Low RDS(ON)
  Solution in the ChipFET Package
  
• Miniature ChipFET Package 40% Smaller Footprint than TSOP−6
  
• Low Profile (<1.1 mm) Allows it to Fit Easily into Extremely Thin
  Environments such as Portable Electronics
  
• Simplifies Circuit Design since Additional Boost Circuits for Gate
  Voltages are not Required
  
• Operated at Standard Logic Level Gate Drive, Facilitating Future
  Migration to Lower Levels using the same Basic Topology
  
• Pb−Free Package is Available

应用

• Optimized for Battery and Load Management Applications in Portable Equipment such as MP3 Players, Cell Phones, and PDAs
• Charge Control in Battery Chargers
• Buck and Boost Converters

封装图 PACKAGE DIMENSIONS