技术特性

• WDFN Package Provides Exposed Drain Pad for Excellent Thermal
  Conduction
  
• 2x2 mm Footprint Same as SC−88
  
• Lowest RDS(on)in 2x2 mm Package
  
• 1.8 V RDS(on) Rating for Operation at Low Voltage Logic Level Gate
  Drive
  
• Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
  
• This is a Pb−Free Device

封装图 PACKAGE DIMENSIONS