技术特性

• UDFN Package with Exposed Drain Pads for Excellent Thermal
  Conduction
  
• Low Profile UDFN 1.6 x 1.6 x 0.55 mm for Board Space Saving
  
• Ultra Low RDS(on)
  
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
  Compliant

优势

• Excellent Thermal Conduction
• Board Space Saving
• Efficiency Improvement

应用

• Optimized for Power Management Applications for Portable Products, Such as Cell Phones, PMP, Media Tablets, DSC, GPS, and Others
• Battery Switch
• High Side Load Switch

终端产品

• Portable Products such as Cell Phones, PMP, Media Tablets, DSC, GPS, and Others

封装图 PACKAGE DIMENSIONS