技术特性

• High Efficiency Components in a Dual SOIC−8 Package
  
• High Density Power MOSFET with Low RDS(on)
  
• Miniature SOIC−8 Surface Mount Package − Saves Board Space
  
• Diode Exhibits High Speed with Soft Recovery
  
• IDSS Specified at Elevated Temperature
  
• Avalanche Energy Specified
  
• Mounting Information for the SOIC−8 Package is Provided
  
• Pb−Free Package is Available

应用

• DC-DC Converters
• Low Voltage Motor Control
• Power Management in Portable and Battery-Powered Products, i.e.: 
  Computers, Printers, PCMCIA Cards, Cellular & Cordless Telephones

封装图 PACKAGE DIMENSIONS