技术特性

• High Density Power MOSFET with Ultra Low RDS(on)
  Providing Higher Efficiency
  
• Miniature SOIC−8 Surface Mount Package − Saves Board Space
  
• Diode Exhibits High Speed with Soft Recovery
  
• IDSS Specified at Elevated Temperature
  
• Drain−to−Source Avalanche Energy Specified
  
• Mounting Information for the SOIC−8 Package is Provided
  
• These Devices are Pb−Free and are RoHS Compliant
  
• NVMS Prefix for Automotive and Other Applications Requiring
  Unique Site and Control Change Requirements; AEC−Q101
  Qualified and PPAP Capable

应用

• Power Management in Portable and Battery-Powered Products, i.e.: Computers, Printers, PCMCIA Cards, Cellular & Cordless Telephones

封装图 PACKAGE DIMENSIONS