技术特性

• Standard Zener Breakdown Voltage Range - 6.8 to 200 V
• Peak Power - 600 Watts @ 1 ms
• Maximum Clamp Voltage @ Peak Pulse Current
• Low Leakage < 5 mA Above 10 V
• UL Recognition
• Response Time is Typically < 1 ns
• Mechanical Characteristics
• CASE: Void-free, transfer-molded, thermosetting plastic
• FINISH: All external surfaces are corrosion resistant and leads are readily solderable
• POLARITY: Cathode indicated by molded polarity notch. When operated in zener mode, will be positive with respect to anode
• MOUNTING POSITION: Any
• LEADS: Modified L-Bend providing more contact area to bond pad
• MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds
• WAFER FAB LOCATION: Phoenix,Arizona
• ASSEMBLY/TEST LOCATION: Seremban, Malaysia
• These devices are available in Pb-free package(s). Specifications herein apply to both standard and Pb-free devices. Please see our website at www.onsemi.com for specific Pb-free orderable part numbers, or contact your local ON Semiconductor sales office or representative.
• AEC-Q101 Qualified and PPAP Capable
• SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

封装图 PACKAGE DIMENSIONS