STEVAL-IFP014V1 IO-link device evaluation board based on STM32F103T6U6 and L6361

The STEVAL-IFP014V1 is a demonstration board designed for evaluation of "IO-Link device". It can be utilized with either sensor or actuator functionality depending on the firmware. It is based on IO-Link physical layer (L6362) controlled by STM32 (STM32F103T6U6), 32-bit Flash microcontroller based on the ARM® Cortex™-M3.

The design of the board allows evaluation of either IO-Link physical layer (L6362) or complete IO-Link device application.

The board is assembled with two sensors: LIS302DL MEMS accelerometer LIS302DL MEMS accelerometer and LY530AL MEMS gyroscope connected to STM32 microprocessor via SPI interface. Using STM32 and L6362 an intelligent IO-Link device application can be implemented.

CD-ROM delivered with the board contains several firmware examples (IAR projects). The examples demonstrate usage of MEMS sensors as IO-Link devices and a binary actuator application.

IO-Link device software stack is available from our partner (third party) – MESCO Engineering GmbH.

技术特性
  • IO-Link device - sensor/actuator functionality
  • Connector for three-wire connection of the sensor board to the master
  • Supports all communication speeds: 4.8, 38.4 and 230 kbps
  • Additional digital Input/Output connector
  • I²C communication between STM32 and L6362 physical layer (register access)
  • Fully protected solution (overvoltage, overtemperature, short-circuit)
  • Supply voltage 8 V - 32.5 V DC
  • Selectable system supply voltage 5 V/3.3 V with L6362 integrated VREG
  • Dual LED diagnostics
  • Integrated surge protection according to IEC61000-4-5 / 500 Ω impedance
  • 11.059 MHz system clock (±2%) from L6362
  • Integrated sensors connected via SPI:
    • LIS302DL MEMS accelerometer
    • LY530AL MEMS gyroscope
功能框图
STEVAL-IFP014V1 订购信息
订购型号 产品状态 美金价格 数量 封装 包装形式 温度范围 材料声明
STEVAL-IFP014V1 Preview   1000        
DATA BRIEF
描述 版本 大小
STEVAL-IFP014V1 : IO-Link device demonstration board based on STM32F103T6U6 and L6362 1 139KB
BILL OF MATERIALS
描述 版本 大小
Bill of materials 1.0.0 12KB
SCHEMATIC PACKS
描述 版本 大小
Board schematic 1.0.0 49KB
PCB LAYOUTS
描述 版本 大小
PCB layout 1.0.0 199KB