74AC16244 具有三态输出的 16 位缓冲器和线路驱动器
74AC16244 描述
The 'AC16244 are 16-bit buffers/line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. They can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide true outputs and symmetrical active-low output-enable 
inputs. When 
is low, the device passes noninverted data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.
The 74AC16244 is packaged in the TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed-circuit-board area
| 74AC16244 | |
| Voltage Nodes(V) | 5, 3.3 |
| Vcc range(V) | 3.0 to 5.5 |
| Logic | True |
| Input Level | CMOS |
| Output Level | CMOS |
| Output Drive(mA) | -24/24 |
| No. of Outputs | 16 |
| tpd max(ns) | 7.9 |
| Static Current | 0.08 |
| Rating | Catalog |
| Technology Family | AC |
74AC16244 特性
- Members of the Texas Instruments WidebusTM Family
- 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
- Flow-Through Architecture Optimizes PCB Layout
- Distributed VCC and GND Configuration Minimizes High-Speed Switching Noise
- EPIC TM (Enhanced-Performance Implanted CMOS) 1-
m Process
- 500-mA Typical Latch-Up Immunity at 125°C
- Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages Using 25-mil Center-to-Center Pin Spacings, and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings
74AC16244 芯片订购指南
| 器件 | 状态 | 温度 | 价格（美元） | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| 74AC16244DGGR | ACTIVE | -40 to 85 | 1.25 | 1ku | TSSOP (DGG) | 48 | 2000 | LARGE T&R | AC16244 |
| 74AC16244DGGRE4 | ACTIVE | -40 to 85 | 1.25 | 1ku | TSSOP (DGG) | 48 | 2000 | LARGE T&R | AC16244 |
| 74AC16244DGGRG4 | ACTIVE | -40 to 85 | 1.25 | 1ku | TSSOP (DGG) | 48 | 2000 | LARGE T&R | AC16244 |
| 74AC16244DL | ACTIVE | -40 to 85 | 1.60 | 1ku | SSOP (DL) | 48 | 25 | TUBE | AC16244 |
| 74AC16244DLG4 | ACTIVE | -40 to 85 | 1.60 | 1ku | SSOP (DL) | 48 | 25 | TUBE | AC16244 |
| 74AC16244DLR | ACTIVE | -40 to 85 | 1.35 | 1ku | SSOP (DL) | 48 | 1000 | LARGE T&R | AC16244 |
| 74AC16244DLRG4 | ACTIVE | -40 to 85 | 1.35 | 1ku | SSOP (DL) | 48 | 1000 | LARGE T&R | AC16244 |
74AC16244 质量与无铅数据
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| 74AC16244DGGR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | 74AC16244DGGR | 74AC16244DGGR |
| 74AC16244DGGRE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | 74AC16244DGGRE4 | 74AC16244DGGRE4 |
| 74AC16244DGGRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | 74AC16244DGGRG4 | 74AC16244DGGRG4 |
| 74AC16244DL | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | 74AC16244DL | 74AC16244DL |
| 74AC16244DLG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | 74AC16244DLG4 | 74AC16244DLG4 |
| 74AC16244DLR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | 74AC16244DLR | 74AC16244DLR |
| 74AC16244DLRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | 74AC16244DLRG4 | 74AC16244DLRG4 |
74AC16244 应用技术支持与电子电路设计开发资源下载
- 74AC16244 数据资料 dataSheet 下载.PDF
- TI 德州仪器缓冲器、驱动器/收发器产品选型与价格 . xls
- CMOS 非缓冲反向器在振荡器电路中的使用 (PDF 951 KB)
- Semiconductor Packing Methodology (PDF 3005 KB)
- 逻辑产品选择指南 2006/2007 （修订版 Z）(4462KB)
- 标准线性和逻辑产品 5 分钟指南 (786KB)
- 了解和解释标准逻辑数据表
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)
