TMS320C6670 多核定点和浮点片上系统
The TMS320C6670 Multicore Fixed and Floating Point System on Chip is a member of the C66xx SoC family based on TI's new KeyStone Multicore SoC Architecture designed specifically for high performance applications such as software defined radio, emerging broadband and other communications segments. Integrated with four C66x CorePac DSPs, each core runs at 1.0 to 1.20 GHz enabling up to 4.8 GHz. Hardware acceleration provides a highly integrated, power efficient and easy to use platform for implementing a combination of multi-band, multi-standard waveforms, including proprietary air-interfaces. The C6670 platform is power efficient and easy to use. The C66x CorePac DSP is fully backward compatible with all existing C6000 family of fixed and floating point DSPs.
TMS320C6670 特性
- Four TMS320C66x DSP Core Subsystems at 1.00 GHz and 1.2GHz
- 153.6 GMAC/76.8 GFLOP @ 1.2GHz
- 32KB L1P, 32KB L1D, 1024KB L2 Per Core
- 2MB Shared L2
- Multicore Navigator and TeraNet Switch Fabric - 2 Tb
- Network Coprocessors- Packet Accelerator, Security Accelerator
- Four Lanes of SRIO 2.1 - 5 Gbaud Per Lane Full Duplex
- Two Lanes PCIe Gen2 - 5 Gbaud Per Lane Full Duplex
- HyperLink - 50Gbaud Operation, Full Duplex
- Ethernet MAC Subsystem - Two SGMII Ports w/ 10/100/1000 Mbps operation
- 64-Bit DDR3 Interface (DDR3-1600) - 8 GByte Addressable Memory Space
- Six Lane SerDes-Based Antenna Interface (AIF2) - Operating at up to 6.144 Gbps
- Hardware Coprocessors
- -Enhanced Coprocessor for Turbo Encoding
-Three Enhanced Coprocessors for Turbo Decoding
-Four Viterbi Decoders
-Three Fast Fourier Transform Coprocessors
-Bit Rate CoProcessor
-Two Receiver Accelerators for WCDMA
-Transmitt Accelerator for WCDMA
- Four Rake Search Accelerators for Chip Rate Processing and Reed-Muller Decoding
- I2C Interface, 16 GPIO Pins, SPI Interface
- Eight 64-Bit Timers, Three On-Chip PLLs
TMS320C6670 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| TMX320C6670CYP |
|
|
|
FCBGA (CYP) | 841 |
|
|
TMS320C6670 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| TMX320C6670CYP |
|
|
|
TMX320C6670CYP |
TMX320C6670CYP |
TMS320C6670 应用技术支持与电子电路设计开发资源下载
- TMS320C6670 数据资料 dataSheet 下载.PDF
- TI 德州仪器数字信号处理器 (DSP) & ARM 微处理器选型与价格 . xls
- OMAP-L13x/AM1x Linux PSP Overview
- ARM Assembly Language Tools v4.7 User's Guide
- ARM Optimizing C/C++ Compiler v4.7 User's Guide
- Power Management for AM18xx/AM17xx Processors
- ARM Portfolio Technical Overview Brochure
- Software and Hardware Design Challenges due to Dynamic Raw NAND Market
- Programmable Real-Time Unit (PRU): Extending Functionality Of Existing SoCs
TMS320C6670 工具与软件
