TPS2021-Q1 汽车类配电开关

TPS2021-Q1 描述

The TPS202x family of power distribution switches is intended for applications where heavy capacitive loads and short circuits are likely to be encountered. These devices are 50-m N-channel MOSFET high-side power switches. The switch is controlled by a logic enable compatible with 5-V logic and 3-V logic. Gate drive is provided by an internal charge pump designed to control the power-switch rise times and fall times to minimize current surges during switching. The charge pump requires no external components and allows operation from supplies as low as 2.7 V. When the output load exceeds the current-limit threshold or a short is present, the TPS202x limits the output current to a safe level by switching into a constant-current mode, pulling the overcurrent (OC) logic output low

TPS2021-Q1
Vin(Min)(V) 2.7  
Vin(Max)(V) 5.5  
Current Limit(A) 0.9
rDS(on) per FET(Typ)(mOhms) 33  
Pin/Package 8SOIC  
Operating Temperature Range(°C) -40 to 85  
Continuous Current(Max)(A) 0.6
Number of Switches 1  
Enable Active Low  
Rating Automotive
TPS2021-Q1 特性
TPS2021-Q1 芯片订购指南
器件 状态 温度 (oC) 价格(美元) | Quantity 封装 | 引脚 封装数量 | 封装载体 丝印标记
TPS2021IDRG4Q1 ACTIVE -40 to 85 1.05 | 1ku SOIC (D) | 8 2500 2021Q1
TPS2021IDRQ1 ACTIVE -40 to 85 1.05 | 1ku SOIC (D) | 8 2500 2021Q1
TPS2021-Q1 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TPS2021IDRG4Q1 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TPS2021IDRG4Q1 TPS2021IDRG4Q1
TPS2021IDRQ1 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM TPS2021IDRQ1 TPS2021IDRQ1
TPS2021-Q1 应用技术支持与电子电路设计开发资源下载
  1. TPS2021-Q1 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器USB 电源开关产品选型与价格 . xls
  3. PowerPAD™ Thermally Enhanced Package   (PDF  1040 KB)
  4. 全面认识开关型电源中的BUCK-BOOST功率级 (Rev. A)   (PDF  2206 KB)
  5. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  6. Comparing Performance of Current Ramp and Voltage Ramp Hot Swap Controller ICs   (PDF  356 KB)
  7. PowerPAD™ Made Easy (PDF 57 KB)
  8. 标准线性产品交叉参考 (Rev. D)   (PDF  1058 KB)
  9. 模数规格和性能特性术语表 (Rev. A) (PDF 1993 KB)
  10. 所选封装材料的热学和电学性质 (PDF 645 KB)
  11. 高速数据转换 (PDF 1967 KB)