UCC27200-Q1 汽车类 120V 升压 3A 峰值电流的高频高端/低端驱动器
|
UCC27200-Q1 |
No. of Outputs |
2 |
Driver Configuration |
Non-Inverting |
VCC(Min)(V) |
8 |
VCC(Max)(V) |
20 |
Peak Output Current(A) |
3 |
Rise Time(ns) |
8 |
Fall Time(ns) |
7 |
Prop Delay(ns) |
20 |
Input Threshold |
5.8 |
Pin/Package |
8SO PowerPAD |
Rating |
Automotive |
Operating Temperature Range(°C) |
-40 to 125 |
UCC27200-Q1 描述
The UCC27200/1 family of high-frequency N-channel MOSFET drivers include a 120-V bootstrap diode and high-side/low-side driver with independent inputs for maximum control flexibility. This allows for N-channel MOSFET control in half-bridge, full-bridge, two-switch forward, and active clamp forward converters. The low-side and the high-side gate drivers are independently controlled and matched to 1 ns between the turn-on and turn-off of each other.
An on-chip bootstrap diode eliminates the external discrete diodes. Undervoltage lockout is provided for both the high-side and the low-side drivers, forcing the outputs low if the drive voltage is below the specified threshold.
Two versions of the UCC2720x are offered — the UCC27200 has high-noise-immune CMOS input thresholds, and the UCC27201 has TTL-compatible thresholds.
UCC27200-Q1 特性
- Qualified for Automotive Applications
- Specified from -40°C to 140°C
- Drives Two N-Channel MOSFETs in High-Side/Low-Side Configuration
- Maximum Boot Voltage 120 V
- Maximum VDD Voltage 20 V
- On-Chip 0.65-V VF, 0.6-Ω RD Bootstrap Diode
- Greater than 1 MHz of Operation
- 20-ns Propagation Delay Times
- 3-A Sink, 3-A Source Output Currents
- 8-ns Rise/7-ns Fall Time with 1000-pF Load
- 1-ns Delay Matching
- Undervoltage Lockout for High-Side and Low-Side Driver
- APPLICATIONS
- Power Supplies for Telecom, Datacom, and Merchant Markets
- Half-Bridge Applications and Full-Bridge Converters
- Isolated Bus Architecture
- Two-Switch Forward Converters
- Active-Clamp Forward Converters
- High-Voltage Synchronous-Buck Converters
- Class-D Audio Amplifiers
UCC27200-Q1 芯片订购指南
器件 |
状态 |
温度 (oC) |
价格(美元) |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
UCC27200QDDARQ1 |
ACTIVE |
-40 to 125 |
1.55 | 1ku |
SO PowerPAD (DDA) | 8 |
2500 |
27200 |
UCC27200-Q1 质量与无铅数据
器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
UCC27200QDDARQ1 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-4-260C-72 HR |
|
UCC27200QDDARQ1 |
UCC27200-Q1 应用技术支持与电子电路设计开发资源下载
- UCC27200-Q1 数据资料 dataSheet 下载.PDF
- TI 德州仪器AC/DC 和 DC/DC 电源产品选型与价格参考 . xls
- Dual MOSFET Driver
(PDF 498 KB)
- 标准线性产品交叉参考 (Rev. D)
(PDF 1058 KB)
- 模数规格和性能特性术语表 (Rev. A) (PDF 1993 KB)
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 高速数据转换 (PDF 1967 KB)
- Shelf-Life Evaluation of Lead-Free Component Finishes (PDF
1305 KB)
- Analog-to-Digital Converter Grounding Practices Affect System
Performance (PDF 56 KB)
- Principles of Data Acquisition and Conversion (PDF 50 KB)
- Interleaving Analog-to-Digital Converters (PDF 64 KB)
- What
Designers Should Know About Data Converter Drift (PDF 95 KB)
- Giving Delta-Sigma Converters a Gain Boost with a Front End
Analog Gain Stage (PDF 70 KB)
- Programming Tricks for Higher Conversion Speeds Utilizing Delta
Sigma Converters (PDF 105 KB)
UCC27200-Q1 工具与软件