TDP Molded, Dual-In-Line Thin Film Resistor, Through Hole Network

技术特性
  • Standard rugged, molded case construction (14 pins and 16 pins)
  • Highly stable thin film (500 ppm at +70 °C at 2000 h)
  • Low temperature coefficient (± 25 ppm/°C)
Datasheet
Approval Documents
General Information
Lead Free
Product Literature
TDP 60045
Certificate 60013
Land Patterns 60013
Lead-Free Family Summary Sheet - Resistor Components 60013
Capabilities 60013
Product Overview 60013
Product Sheet 60013
TDP Molded, Dual-In-Line Thin Film Resistor, Through Hole Network 60045