MTR Wire Bondable Thin Film Multi-Tap Resistor Arrays

技术特性
  • Wire bondable
  • Selectable values by wire bonding
  • Chip size: 0.030" x 0.030"
Datasheet
Packaging Information
MTR 61045
Waffle Pack Packaging 61095
MTR Wire Bondable Thin Film Multi-Tap Resistor Arrays 61045