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SiHD6N62E E Series Power MOSFET

技术特性

• Low figure-of-merit (FOM) Ron x Qg
• Low input capacitance (Ciss)
• Reduced switching and conduction losses

Datasheet

• SiHD6N62E

General Information

• General Information - Useful Web Links

Package Drawings

• Package Information - TO-252AA (High Voltage)
• Package Information - TO-252AA Case Outline

Pad Guidelines

• Application Note 826 - RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)

RC Thermal Models

• SiHD6N62E_RC - R-C Thermal Model Parameters

Reliability Data

• Package Reliability - Environmental and Package Testing Data for DPAK (TO-252), IPAK (HVM)
• Silicon Technology Reliability - N-Channel Accelerated Operating Life Test Result

SPICE Models (*.pdf)

• SiHD6N62E-DS - DS-SPICE Model for SiHD6N62E

SPICE Models (*.zip)

• SiHD6N62E-zip - SPICE Models for SiHD6N62E