• 简体中文
• English

SiHH11N60E E Series Power MOSFET

技术特性

• Fully lead (Pb)-free device
• Low figure-of-merit (FOM) Ron x Qg
• Low input capacitance (Ciss)

Datasheet

• SiHH11N60E

Markings

• Part Marking Information - PowerPAK® 8 x 8

Package Drawings

• Package Information - PowerPAK® 8 x 8 Case Outline

Pad Guidelines

• PAD Pattern - Recommended Minimum PADs for PowerPAK® 8 mm x 8 mm

RC Thermal Models

• SiHH11N60E_RC - R-C Thermal Model Parameters

Reel Info

• Reel Information - Reel

Reliability Data

• Package Reliability - Environmental and Package Testing Data for PowerPAK® 8 x 8

Tape Info

• Device Orientation - Device Orientation for PowerPAK 8 X 8
• Tape Information - PowerPAK® 8 x 8 Carrier Tape

SPICE Models (*.pdf)

• SiHH11N60E-DS - DS-SPICE Model for SiHH11N60E

SPICE Models (*.zip)

• SiHH11N60E-zip - SPICE Models for SiHH11N60E