HMC356 350 - 550 MHz低噪声放大器SMT

HMC356LP3(E)是一款高动态范围GaAs PHEMT MMIC低噪声放大器，非常适合GSM和CDMA蜂窝基站和移动无线电前端接收机，工作频率范围为350至550 MHz。 该LNA经过优化，在+5V单电源时(104 mA)提供1 dB的噪声系数、17 dB的增益和+38 dBm的输出IP3。 输入和输出回损为15 dB（典型值），LNA仅需四个外部元件，即可优化RF输入匹配、RF接地和直流偏置。

应用
  • GSM 450 和 GSM 480
  • CDMA 450
  • 私有/陆地移动无线电
产品特点和性能优势
  • 噪声系数： ≤ 1 dB
  • 输出IP3： +38 dBm
  • 增益： 17 dB
  • 在电源和温度范围内具有非常稳定的增益
  • 单电源： +5V (104 mA)
  • 50 Ω匹配输出
    • 放大器
    S参数
    数据手册
    文档备注
    HMC356 Data SheetPDF 631.41 K
    应用笔记
    文档备注
    AN-1363: 利用有源偏置控制器满足外部偏置射频/微波放大器的偏置要求 (Rev. 0)PDF 804.11 K
    AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers (Rev. 0)PDF 804.11 K
    MMIC Amplifier Biasing Procedure Application NotePDF 435.1 K
    Broadband Biasing of Amplifiers General Application NotePDF 433.77 K
    Thermal Management for Surface Mount Components General Application NotePDF 189.99 K
    订购信息
    产品型号封装包装数量温度范围美金报价 100-499美金报价 1000+RoHS
    HMC356LP3 量产16 ld QFN (3x3mm w/1.7mm ep)OTH 50-40 至 85至8.727.14N
    HMC356LP3E 量产16 ld QFN (3x3mm w/1.7mm ep)OTH 50-40 至 85至6.515.33Y
    HMC356LP3ETR 量产16 ld QFN (3x3mm w/1.7mm ep)REEL 500-40 至 85至6.515.33Y
    HMC356LP3TR 量产16 ld QFN (3x3mm w/1.7mm ep)REEL 500-40 至 85至8.727.14N
    评估板
    产品型号描述美金报价RoHS
    107795-HMC356LP3Evaluation Board - HMC356LP3 Evaluation PCB259.77Y
    参考资料
    Datasheet
    HMC356 Data Sheet hmc356
    Other
    Active Multipliers & Dividers to Simplify Synthesizers hmc356
    AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers (Rev. 0) hmc8120
    AN-1363: 利用有源偏置控制器满足外部偏置射频/微波放大器的偏置要求 (Rev. 0) hmc8120
    Broadband Biasing of Amplifiers General Application Note hmc1049lp5e
    HMC356 S-Parameter hmc356
    MMIC Amplifier Biasing Procedure Application Note hmc1049lp5e
    Package/Assembly Qualification Test Report: Plastic Encapsulated QFN (QTR:... hmc344
    Package/Assembly Qualification Test Report: 16L 3x3mm QFN Package (QTR:... hmc344
    Semiconductor Qualification Test Report: PHEMT-B (QTR: 2013-00233) hmc536ms8g
    Package/Assembly Qualification Test Report: LP2, LP2C, LP3, LP3B, LP3C,... hmc344
    Thermal Management for Surface Mount Components General Application Note hmc1049lp5e
    LP3, LC3, LC3B Tape and Reel Outline Dimensions hmc344
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