HMC453ST89 1.6 W功率放大器,采用SMT封装,0.4 - 2.2 GHz

HMC453ST89(E)是一款高动态范围GaAs InGaP HBT、1.6瓦特MMIC功率放大器,工作频率范围为0.4至2.2 GHz,采用业界标准SOT89封装。 它仅使用极小数量的外部元件和单个+5V电源,其输出IP3可以优化为+47 dBm(0.4 GHz时)或+49 dBm(2.1 GHz时)。 高输出IP3和PAE使得HMC453ST89(E)成为适合蜂窝/PCS/3G和固定无线应用的理想功率放大器。

应用
  • GSM, GPRS 和 EDGE
  • CDMA 和W-CDMA
  • 有线电视/电缆调制解调器
  • 固定无线
产品特点和性能优势
  • 输出IP3: +49 dBm
  • 增益:20.5 dB (400 MHz)
  • 增益:7.5 dB (2100 MHz)
  • PAE为41%(Pout为+32.5 dBm时)
  • +26 dBm的CDMA2000
    通道功率(ACP为-45 dBc时)
  • 放大器
    S参数
    数据手册
    文档备注
    HMC453ST89 Data SheetPDF 1.11 M
    应用笔记
    文档备注
    AN-1363: 利用有源偏置控制器满足外部偏置射频/微波放大器的偏置要求 (Rev. 0)PDF 804.11 K
    AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers (Rev. 0)PDF 804.11 K
    MMIC Amplifier Biasing Procedure Application NotePDF 435.1 K
    Broadband Biasing of Amplifiers General Application NotePDF 433.77 K
    Thermal Management for Surface Mount Components General Application NotePDF 189.99 K
    订购信息
    产品型号封装包装数量温度范围美金报价 100-499美金报价 1000+RoHS
    HMC453ST89 最后一次采购SOT_89OTH 50-40 至 85至11.359.19N
    HMC453ST89E 量产SOT_89OTH 50-40 至 85至11.059.13Y
    HMC453ST89ETR 量产SOT_89REEL 500-40 至 85至11.059.13Y
    评估板
    产品型号描述美金报价RoHS
    108718-HMC453ST89Evaluation Board - HMC453ST89 Evaluation PCB, 1900 MHz347.13Y
    109942-HMC453ST89Evaluation Board - HMC453ST89 Evaluation PCB, 2100 MHz347.13Y
    110387-HMC453ST89Evaluation Board - HMC453ST89 Evaluation PCB, 900 MHz347.13Y
    110957-HMC453ST89Evaluation Board - HMC453ST89 Evaluation PCB, 400 MHz347.13Y
    110961-HMC453ST89Evaluation Board - HMC453ST89 Evaluation PCB, 470 MHz332.53Y
    参考资料
    HMC453ST89 Data Sheet hmc453st89
    HMC453ST89 S-Parameters hmc453st89
    AN-1363: 利用有源偏置控制器满足外部偏置射频/微波放大器的偏置要求 (Rev. 0) hmc8120
    AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers (Rev. 0) hmc8120
    MMIC Amplifier Biasing Procedure Application Note hmc1049lp5e
    Broadband Biasing of Amplifiers General Application Note hmc1049lp5e
    Thermal Management for Surface Mount Components General Application Note hmc1049lp5e
    Semiconductor Qualification Test Report: GaAs HBT-B (QTR: 2013-00229) hmc311sc70
    Package/Assembly Qualification Test Report: 3 Lead Plastic SOT89 Package... hmc311st89
    SOT89 Tape Specification (ST89) hmc311st89