HMC492 InGaP HBT Divide-by-2 SMT, DC - 18 GHz

The HMC492LP3(E) is a low noise Divide-by-2 Static Divider utilizing InGaP GaAs HBT technology packaged in leadless 3x3 mm QFN surface mount plastic package. This device operates from DC (with a square wave input) to 18 GHz input frequency from a single +5V DC supply. The low additive SSB phase noise of -150 dBc/Hz at 100 kHz offset helps the user maintain excellent system noise performance.

Applications

产品特点和性能优势
  • Ultra Low SSB Phase Noise: -150 dBc/Hz
  • Very Wide Bandwidth
  • Output Power: -4 dBm
  • Single DC Supply: +5V
  • 3x3 mm QFN SMT Package
射频和微波
数据手册
文档备注
HMC492 Data SheetPDF 583.35 K
订购信息
产品型号封装包装数量温度范围美金报价 100-499美金报价 1000+RoHS
HMC492LP3 量产16 ld QFN (3x3mm w/1.7mm ep)OTH 50-40 至 85至19.3615.68N
HMC492LP3E 量产16 ld QFN (3x3mm w/1.7mm ep)OTH 50-40 至 85至15.4912.54Y
HMC492LP3ETR 量产16 ld QFN (3x3mm w/1.7mm ep)REEL 500-40 至 85至15.4912.54Y
HMC492LP3TR 量产16 ld QFN (3x3mm w/1.7mm ep)REEL 500-40 至 85至19.3615.68N
评估板
产品型号描述美金报价RoHS
107384-HMC492LP3Evaluation Board - HMC492LP3 Evaluation PCB330.78Y
参考资料
HMC492 Data Sheet hmc492
Semiconductor Qualification Test Report: GaAs HBT-A (QTR: 2013-00228) hmc587
Package/Assembly Qualification Test Report: LP2, LP2C, LP3, LP3B, LP3C,... hmc344
Package/Assembly Qualification Test Report: 16L 3x3mm QFN Package (QTR:... hmc344
Package/Assembly Qualification Test Report: Plastic Encapsulated QFN (QTR:... hmc344
LP3, LC3, LC3B Tape and Reel Outline Dimensions hmc344