HMPP-3890 MiniPak PIN 开关二极管 _ BDTIC 中国领先电子元器件代理商

HMPP-3890 MiniPak PIN 开关二极管

特点

HMPP-389x 系列非常适合需要在低电流低电压下拥有低电阻值的开关切换应用。和传统引线式二极管相较，MiniPak 封装提供较低的寄生电阻，而且热阻也较低。VBR=50 V, Ct=0.30 pF, Rs@5mA=2.5 0hms, Tau= 200 nSec。

Specification	Value
Lifecycle	Active
Samples Available	Yes
Bkdwn Vo In V	50.0
Carrier Life In Nsec (ns)	200
Connection	Single
RoHS6 Compliant	Y
Max Cap In Pf	0.3
Distrib. Inventory	Yes
Max Qty of Samples	25
Peak Output Current Min Uom	MSL 22
Mounting Direction	Top
Mounting Method	Solder Reflow
Pin Count	4.0
Product Type	Low Resistance Switch
Lifetime Ns	200.0
Ct (pF)	0.2
RS (ohm)	2.5
VBR (V)	100
Vbr V	100.0
Ct Pf	0.2
Series Res In Ohms	2.5
Configuration	Single
Package	Minipak

Application Brief (1)

Surface Mount Schottky PIN Diode.pdf（08/02/2006）

Application Note (12)

HMPP-3890 and HMPP-389T - 2.4 GHz Series Shunt TR Switch - AN5327.pdf（08/18/2010）
AN 9571: Broading the Shunt PIN Diode SPDT Switch.pdf（08/16/2010）
AN 1312: Evaluating the HMPP-3860, HMPP-3890 PIN Switches on the RW053B Demoboard.pdf（08/14/2010）
AN 9572: Reducing the Insertion Loss a Shunt PIN Diode.pdf（08/14/2010）
AN 1067: An SPDT PIN Diode T R Switch for PCN Applications.pdf（08/13/2010）
AN 1067: An SPDT PIN Diode T R Switch for PCN Applications.pdf（08/13/2010）
AN 1049: A Distortion PIN Diode Switch Surface Mount Devices.pdf（08/13/2010）
AN 1072: Applications for the HSMP3890 Surface Mount Switching PIN Diode.pdf（08/13/2010）
AN 1124: Linear Models for Diode Surface Mount Packages.pdf（07/21/2010）
AN A004R: Electrostatic Discharge mage Control.pdf（07/14/2010）
AN 1048: Cost Surface Mount PIN Diode Pi Attenuator.pdf（07/13/2010）
AN A006: Mounting Considerations for Microwave Semiconductors.pdf（07/22/2009）

Data Sheet (1)

HMPP-389x, MiniPak Surface Mount RF PIN Switch Diodes.pdf（08/05/2009）

Product Change Notice (PCN) (9)

V13-004-480035-0A - Change of platform and Alternative second source for testing Quad Flat.pdf（03/12/2013）
V12-009-480036-0A - Change in cover tape material.pdf（04/25/2012）
V08-019-480036-0A.pdf（12/11/2008）
A06-003-480035-0A, Nov.2005.pdf（12/21/2005）
CCN082701TC1 - Si wafer substrate will change from 3" to 4".pdf（10/28/2005）
CCN021402AT1 - Transfer of semiconductor wafer fabrication.pdf（10/28/2005）
PCN: A04-013-480035-0A, Dec. 2004.pdf（12/17/2004）
PCN: A04-002-480035-0A, Apr. 2004.pdf（04/07/2004）
CCN082401TC1 - Si wafer epitaxy transferred from Newark to San Jose, CA fab.pdf（08/24/2001）

Reliability Data Sheet (1)

HMPP-386x/HMPP-389x, Series MiniPak PIN Diode.pdf（02/12/2008）

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