HSMG-C110 表面贴装 ChipLED

这一系列的直角安装 ChipLED 通过设计采用极小的引脚以构成高密度电路板。其引脚高度仅为 0.6 毫米,长宽尺寸为 1.6 毫米 x 1.0 毫米,符合工业标准。这使得它们非常适合用于 C

特点
  • 体积小
  • 工业标准引脚尺寸
  • 适于采用红外回流焊工艺
  • 扩散型光学器件
  • 工作温度范围:-40°C 至 85°C
  • 可提供直角封装
  • 可在 178 毫米(7 英寸)直径的卷轴上镶嵌 8 毫米载带
SpecificationValue
LifecycleActive
Distrib. InventoryYes
Samples AvailableYes
ColorGreen
Color Bin SelectionOpen
Color Coordinates Xy
Dimension Lxwxh In Mm3.2 x 1.0 x 1.5
Intensity Bin SelectionOpen
Lead Bend Configuration
RoHS6 CompliantY
Led Chip TypeGaP
Lens Type
Peak Output Current Min (A)
Max Qty of Samples20
Minimum Luminous Intensity (mcd)4.0
Peak Output Current Min Uom2a
Mounting DirectionSide
Mounting MethodSurface Mount
Number Of ColorsSingle
Operating Temperature Range-40°C to +85°C
PackageRight Angle C110
ROHS5_NonLeadFree
Test Current (mA)20.0
Typical Forward Voltage In V
Typical Dominant Wavelength (nm)572
Typical Luminous Intensity (mcd)16
Viewing Angle (degree)130°
Application Brief (4)
Application Note (3)
Data Sheet (1)
Design Guide (1)
Product Change Notice (PCN) (3)
Reliability Data Sheet (1)