特点- 高功率表面安装 QFN 封装，尺寸 2x2 mm
- 匹配二极管达稳定效能
- 低偏置电流要求
- 低串联电阻
- 低插入损失与高隔离
- 更好的导热更高的功耗
- 低故障时间 (FIT) 率
- 提供无铅选择
- MSL1 与无铅
- 提供卷带与卷轴选择
Applications
高功率表面安装 QFN 封装，尺寸 2x2 mm
匹配二极管达稳定效能
低偏置电流要求
低串联电阻
低插入损失与高隔离
更好的导热更高的功耗
低故障时间 (FIT) 率
提供无铅选择
MSL1 与无铅
提供卷带与卷轴选择
移动基础设施和双向无线电用高功率传送 / 接收开关 | | Specification | Value |
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| Lifecycle | Active | | Samples Available | Yes | | Carrier Life In Nsec (ns) | | | Connection | | | RoHS6 Compliant | Y | | Max Cap In Pf | 1.25 | | Distrib. Inventory | Yes | | Max Qty of Samples | 50 | | Peak Output Current Min Uom | | | Mounting Direction | | | Mounting Method | Solder Reflow | | Package Outline Style | | | Pin Count | 8.0 | | Product Type | | | ROHS5_NonLeadFree | | | Lifetime Ns | 260.0 | | Trr Ns | 130.0 | | Ct (pF) | 1.25 | | RS (ohm) | 0.65 | | Trr (nS) | 130 | | VBR (V) | 100 | | IIP3 (dBm) | | | Control Input (Vdc) | | | Frequency Range (GHz) | | | Loss (dB) | | | Isolation (dB) | | | IP1dB (dBm) | | | Ct Pf | 0.75 | | RD (ohm) | | | Series Res In Ohms | 0.77 | | Configuration | Parallel | | Package | SMT 2x2 |
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