HSMS-282K RF 混频器/二极管检波器 _ BDTIC 中国领先电子元器件代理商

HSMS-282K RF 混频器/二极管检波器

特点

Specification	Value
Lifecycle	Active
Distrib. Inventory	Yes
Samples Available	No
Configuration	High Isolation Unconnected Pair
Ct Pf	1.0
RoHS6 Compliant	Y
Max Qty of Samples	0
Package	SOT-323 (SC-70 3 Lead)
Vbr V	15.0
Vf Mv	340.0
Series Res In Ohms	12.0

Application Brief (1)

Surface Mount Schottky PIN Diode.pdf（08/02/2006）

Application Note (20)

AN 956-5: Dynamic Range Extension Schottky Detectors.pdf（08/16/2010）
AN 988: All Schottky Diodes are Zero Bias Detectors.pdf（08/14/2010）
AN 986: Square Law Linear Detection.pdf（08/14/2010）
AN 963: Matching Techniques for Mixers Detectors.pdf（08/14/2010）
AN 987: Is Bias Current Necessary.pdf（08/14/2010）
AN 1187: Design an Input Matching Network for a DC Biased 850 MHz Small Signal Detector.pdf（08/13/2010）
AN 997: A 2 GHz Balanced Mixer SOT23 Surface Mount Schottky Diodes.pdf（07/31/2010）
AN 1088: Designing the Virtual Battery.pdf（07/22/2010）
AN 1124: Linear Models for Diode Surface Mount Packages.pdf（07/21/2010）
AN 9561: The Criterion for the Tangential Sensitivity Measurement.pdf（07/19/2010）
AN 5380; Double balanced diode mixer using the HSMS-2822.pdf（07/16/2010）
AN A004R: Electrostatic Discharge mage Control.pdf（07/14/2010）
AN 956-3 Flicker Noise Schottky Diodes.pdf（07/13/2010）
AN 1328: HPMS-2825 A Temperature Compensated Linear Power Detector.pdf（07/13/2010）
AN 956-6: Temperature Dependence Schottky Detector Voltage Sensitivity.pdf（06/28/2010）
AN 1069: Non RF Applications for the Surface Mount Schottky Diode Pairs HSMS2802 HSMS2822.pdf（06/16/2010）
AN 9441: Microwave Transistor Bias Considerations.pdf（05/11/2010）
AN A006: Mounting Considerations for Microwave Semiconductors.pdf（07/22/2009）
AN 1156: Diode Detector Simulation EEs ADS Softward.pdf（02/22/2007）
AN 923: Schottky Barrier Video Detectors.pdf（12/09/2006）

Data Sheet (1)

HSMS-282x, Surface Mount RF Schottky Barrier Diodes.pdf（11/28/2014）

Product Change Notice (PCN) (17)

V11-024-480035-0B - Assembly and Test related change.pdf（05/15/2012）
V11-024-480035-0A - Assembly and Test related change.pdf（11/04/2011）
Qualifying New Contract Manufacturers.pdf（03/02/2009）
CCN082701TC1 - Si wafer substrate will change from 3" to 4".pdf（10/28/2005）
CCN021402AT1 - Transfer of semiconductor wafer fabrication.pdf（10/28/2005）
PCN: A05-010-480035-0A, Mar. 2005.pdf（03/18/2005）
PCN: A04-001-480035-0A, Mar. 2004.pdf（03/23/2004）
PCN: A03-003-480035-1A, Sept. 2003.pdf（09/30/2003）
Moisture Sensitive Label/ Humidity Indicator Card Communication Package, Aug. 15, 2002.pdf（09/02/2002）
CCN082401TC1 - Si wafer epitaxy transferred from Newark to San Jose, CA fab.pdf（08/24/2001）
Recall Notification for SOT-323 (SC-70 3-Lead).pdf（04/25/2001）
022500TC1: Customer Change Notification.pdf（06/01/2000）
CCN#9904A-REVISION B: Customer Change Notice.pdf（08/01/1999）
CCN:9811a - HSMS, HBAT laser marking.pdf（11/01/1998）
CCN:9710a - HSMS, HSMP #L30, #L31.pdf（10/10/1997）
CCN:062597dg1- AT, INA, MSA, HSMS, HSMP Mfg. location change.pdf（06/25/1997）
CCN:22195 - Manufacturing Wafer Fab Relocation.pdf（02/21/1995）

Reliability Data Sheet (1)

HBAT-54xx, HSMS-270x, HSMS-280x, HSMS-281x, HSMS-282x, Surface Mount Schottky Diodes Reliability Data Sheet.pdf（08/02/2007）

Spice Model (1)

HSMS-282x_SPICE.etc（02/26/2000）

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