CY7C1474V33-200BGC
CY7C1474V33-200BGC| Architecture | NoBL, Pipeline |
|---|
| Automotive Qualified | N |
|---|
| Burst Length (Words) | 0 |
|---|
| Density (Kb) | 73728 |
|---|
| Density (Mb) | 72 |
|---|
| Frequency (MHz) | 200 |
|---|
| Max. Operating Temp. (°C) | 70 |
|---|
| Max. Operating VCCQ (V) | 3.60 |
|---|
| Max. Operating Voltage (V) | 3.63 |
|---|
| Min. Operating Temp. (°C) | 0 |
|---|
| Min. Operating VCCQ (V) | 2.40 |
|---|
| Min. Operating Voltage (V) | 3.14 |
|---|
| Organization (X x Y) | 1Mb x 72 |
|---|
| Part Family | NoBL |
|---|
| Part Family | NoBL |
|---|
| Tape & Reel | N |
|---|
| Temp. Classification | Commercial |
|---|
Pricing & Inventory Availability| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|
| $168.00 | $142.08 | $137.28 | $131.52 | $127.68 | $123.84 |
- Application Notes
- AN1090 NoBL The Fast SRAM Architecture.pdf English , 12/07/2016
- AN1090 NoBL The Fast SRAM Architecture (Chinese).pdf Chinese , 08/20/2015
- AN1090 NoBL The Fast SRAM Architecture (Japanese).pdf Japanese , 08/20/2015
- Models
- 1474V33.zip English , 11/13/2008
- CY7C1474V33.zip English , 11/13/2008
- Package Material Declaration
- 209 FBGA (14x22x1.76mm) Non Pb-Free Package Material Declaration Datasheet.pdf English , 10/28/2016
- 44L PLCC Pb-Free Package Material Declaration Datasheet.pdf English , 10/28/2016
- Package Outline Drawings
- 51-85167.pdf English , 09/04/2012
- 51-85164.pdf English , 09/04/2012
- 51-85159.pdf English , 09/04/2012
- Product Change Notice
- PCN071546 English , 08/18/2008
- PCN071557 English , 08/18/2008
- PCN050667 English , 08/13/2008
- Qualification Reports
- QTP# 050702: 209-BALL FINE PITCH BALL GRID ARRAY (FBGA) (14 X 22 X 1.76MM) MSL3, 220C SOLDER REFLOW ASE-TAIWAN (G) English , 09/20/2016
- QTP113210: 44-LEAD TSOP (400 MILS) STAMPED LEAD FRAME PURE SN, MSL3, 260C REFLOW OSE (T) - TAIWAN English , 09/20/2016
