CY8CLED04G01-56LTXI
CY8CLED04G01-56LTXI| Automotive Qualified | N |
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| CPU Core | M8C |
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| CapSense | Y |
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| Flash (KB) | 16 |
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| Max. Operating Frequency (MHz) | 2 |
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| Max. Operating Temp. (°C) | 85 |
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| Max. Operating Voltage (V) | 32.00 |
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| Min. Operating Temp. (°C) | -40 |
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| Min. Operating Voltage (V) | 7.00 |
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| No. of GPIOs | 10 |
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| No. of Programmable Analog Blocks | 6 |
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| No. of Programmable Digital Blocks | 8 |
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| SRAM (Bytes) | 1024 |
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| Tape & Reel | N |
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Pricing & Inventory Availability| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|
| $8.79 | $8.43 | $8.06 | $7.69 | $7.32 | $6.70 |
- QTP 075103.pdf English , 09/16/2016
- QTP 84005 56 QFN and 68 QFN Saw Type (8 x 8 x 1mm) NiPdAu-Ag, MSL3, 260C Reflow ASE-Shanghai.pdf English , 08/03/2016
- Qtp 92006 56-lead Saw Qfn (quad Flat No-lead) (8 X 8 X 1.0mm) Nipdau, Msl3, 260°c Reflow, Cml-ra.pdf English , 08/07/2015
- QTP 141003 TSOPII 44L (400mils) Matte Sn, CuPd Wire MSL3, 260C Reflow ASE-K, Taiwan.pdf English , 08/07/2015
- QTP 132403 121-Ball FBGA (Stacked Die) (10x10x1.7mm) SnAgCu, Au Wire MSL3, 260°C Reflow ASE-Taiwan (G).pdf English , 08/07/2015
- QTP 142004 48 uFBGA (4.3 x 4.3 x0.60 mm) Cu-Pd Wirebond SAC105, MSL3, 260C Reflow G-Taiwan.pdf English , 08/07/2015
- QTP 141704 QFN 16L (3x3x0.6mm) QFN 24L(4x4x0.6mm) NiPdAu-Ag, CuPd Wire MSL3, 260C Reflow UTAC, Thailand (UT).pdf English , 08/07/2015
- QTP 141702 40 QFN (6x6x0.6mm) NiPdAu, CuPd Wire MSL3, 260°C Reflow CML-RA .pdf English , 08/07/2015
- QTP 131804 28L SSOP (210mils) NiPdAu , CuPd Wire MSL3, 260C Reflow CML-RA .pdf English , 08/07/2015
- Qtp 141303 44l Tsop (400 Mils) 28/32l S/tsop (300 Mils) Pure Sn, Cupd Wire Msl3, 260c Reflow Jcet-china (jt).pdf English , 08/07/2015
- QTP 141404 44LD TQFP (10X10X1.4mm) Pure Sn, Cu-Pd Wire MSL3, 260°C Reflow ASEK-TAIWAN.pdf English , 08/07/2015
- 56L QFN PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf English , 12/08/2016
- 51-52086.pdf English , 11/27/2014
- cy8cled0xdx.zip English , 03/15/2012
