CYRF9935-24LQXC

CYRF9935-24LQXC
ApplicationWireless HID, Remote Controllers, R/C Models, Wireless Sensor Networks
Automotive QualifiedN
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)1.90
Range (m)10
Tape & ReelN
Throughput (Kbps)2000, 250
Pricing & Inventory Availability
1-9 unit Price*10-24 unit Price*25-99 unit Price*100-249 unit Price*250-999 unit Price*1000+ unit Price*
$2.91$2.51$2.38$1.98$1.93$1.79
CYRF9935: WirelessUSB™ NX 2.4 GHz Low Power Radio Datasheet.pdf English , 04/17/2016
CYRF9935: WirelessUSB™ NX 2.4 GHz Low Power Radio Datasheet (Chinese).pdf Chinese , 04/17/2016
QTP 134704.pdf English , 09/19/2016
QTP 134802 24 QFN (4x4x0.6mm) Pure Sn, CuPd Wire MSL3, 260°C Reflow ASE-Taiwan (G).pdf English , 08/07/2015
QTP 135002 48 Balls FBGA (8x9.5x1.2mm) SAC405, Au Wire MSL3, 260°C Reflow ASEK – Taiwan (G).pdf English , 08/07/2015
QTP 130803 172 Balls FBGA (15x15x1.6mm) 484 Balls FBGA (23x23x1.9mm) SnAgCu, Au Wire MSL3, 260°C Reflow ASEK – Taiwan (G).pdf English , 08/07/2015
QTP 114701 131 Ball Wafer Level Chip Scale Package (WLCSP) RDL MSL1, 260C Deca Technologies (DT) .pdf English , 08/07/2015
QTP 114702 131 Ball Wafer Level Chip Scale Package (WLCSP) BOP MSL1, 260C Deca Technologies (DT) .pdf English , 08/07/2015
QTP 142801 8L SOIC (150mils) NiPdAu, Au Wire MSL3, 260C Reflow CML-RA.pdf English , 08/07/2015
QTP 135103 40-Lead QFN (6x6x1.0mm) Pure Sn, Au Wire MSL3, 260°C Reflow ASEK – Taiwan (G).pdf English , 08/07/2015
QTP 113102 49 Ball Wafer Level Chip Scale Package (WLCSP), 3.215mm x 3.215mm MSL1, 260C Deca Technologies (DT) .pdf English , 08/07/2015
QTP 120807 49 Ball Wafer Level Chip Scale Package (WLCSP), 3.79mmx3.88mmx0.55mm, MSL1, 260C Deca Technologies (DT) .pdf English , 08/07/2015
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