CYS25G0101DX-AEXC
CYS25G0101DX-AEXC| 8B / 10B ENDEC | N |
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| Automotive Qualified | N |
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| Functions | Transceiver |
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| Max. Operating Temp. (°C) | 70 |
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| Max. Operating Voltage (V) | 3.60 |
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| Max. Speed (Mbps) | 2488 |
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| Min. Operating Temp. (°C) | 0 |
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| Min. Operating Voltage (V) | 3.00 |
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| Min. Speed (Mbps) | 155 |
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| No. of Channels | 1 |
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| Standard | OC-48 |
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| Tape & Reel | N |
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Pricing & Inventory Availability| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|
| $171.85 | $164.64 | $157.43 | $150.22 | $143.01 | $130.99 |
- 012906.pdf English , 04/21/2009
- 014201A.pdf English , 04/21/2009
- 001205%20Rev%201.3.pdf English , 04/21/2009
- 003201%20Rev1.1.pdf English , 04/21/2009
- 024502.100ld.TQFP._14x14_.chipmos.pdf English , 04/21/2009
- 024603.TQFP.14x14.korea.pdf English , 04/21/2009
- 004402.CYP25G01100VIA.ASE.pdf English , 04/21/2009
- 99245.CY7C1350.1.2.R52D.3.pdf English , 04/21/2009
- 022102.56lead.SSOP.Autoline.Ni.Pd.260.pdf English , 04/21/2009
- 022504.16L.TSSOP.MSL1.SIGKOREA.pdf English , 04/21/2009
- 022206.20L.QFN_4x4_SeolKorea.pdf English , 04/21/2009
- 014201.pdf English , 04/21/2009
- 023607.KE-G1270.%20MC.FBGA.13x15.pdf English , 04/21/2009
- 013404.CYPS12G100P456.pdf English , 04/21/2009
- 99344.pdf English , 04/21/2009
- 014011.120lead.TQFP.H14x14.SEOULK.pdf English , 04/21/2009
- QTP 84305 120-Lead Exposed Pad TQFP (14 x 14 x 1.0mm) MSL3, 260C Reflow, Amkor - Korea (L).pdf English , 08/07/2015
- QTP 121406 44L TSOP II AND 32L TSOP (400 MILS) NIPDAU, 100% CU WIRE MSL3, 260C REFLOW CML-RA.pdf English , 08/07/2015
- QTP 91203 24-Lead QFN (4X4X0.6) NiPdAu-Ag, MSL3, 260C Reflow Amkor-Phil (Phil-MB).pdf English , 08/07/2015
- QTP 112109 131-Ball Wafer Level Chip Scale Package (WLCSP) , (5.099x4.695x0.60mm) MSL1, 260C Reflow Amkor T5/T3 (Au-Taiwan).pdf English , 08/07/2015
- QTP 120409 8L/16L SOIC (150MILS) PACKAGES NIPDAU 100% CU WIRE MSL3, 260C REFLOW OSE(T) - TAIWAN.pdf English , 08/07/2015
- QTP 33104 32-Lead Thin Small Outlined Package (TSOP I & Il) 100 percent Sn Lead Finish MSL3, 260C Reflow OSE-Taiwan.pdf English , 08/07/2015
- Qtp 34602 32-lead Tqfp (7 X 7 X 1.0mm) 52-lead Tqfp (10 X 10 X 1.0mm) Pb-free, Msl3, 260c Reflow Amkor Bupyeong Korea Assembly.pdf English , 08/07/2015
- QTP 134513 - SOIC 8L (150mils) NiPdAu, CuPd Wire MSL3, 260C Reflow UTAC, Thailand (UT).pdf English , 08/07/2015
- QTP 134506 - SOIC 16L (150mils) NiPdAu-Ag, CuPd Wire MSL3, 260C Reflow UTAC, Thailand (UT).pdf English , 08/07/2015
- QTP 134505 QFN16L (3x3x0.6mm) QFN24L (4x4x0.6mm) Pure Sn, CuPd Wire MSL3, 260C Reflow ASE, Taiwan (G).pdf English , 08/07/2015
- QTP 123605: 84 UFBGA (6X6X0.6 MM), 60UFBGA / 70UFBGA (5.5X5.5X0.60MM),CU-PD WIRE ,SAC105, MSL3,260C REFLOW, ASE-TAIWAN(G).pdf English , 08/07/2015
- QTP 140901 165FBGA (13x15mm) SAC405, Au Wire MSL3, 260C Reflow CML-RA.pdf English , 08/07/2015
- QTP 123603: 84 UFBGA (6X6X0.6 MM), 60 UFBGA (5X5X0.60MM), CU-PD WIREBOND, SAC105, MSL3, 260C REFLOW, AC-TAIWAN English , 08/07/2015
- QTP 042905 48-Ball Very Thin Fine Pitch Ball Grid Array SnAgCu, MSL3, 260C Reflow (AEC-Q100 Automotive) ASE-Taiwan (G).pdf English , 08/07/2015
- PCN145274.zip English , 03/18/2014
- 120L EXPOSED PAD TQFP PB FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf English , 12/01/2016
- 60 BGA (5.5X5.5X0.6MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf English , 10/28/2016
- 84 BGA (6X6X0.6MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf English , 12/01/2016
- Material Declaration Datasheet (MDDS) FBGA056 (RSD056) BKK CuPd Wire Dual Die.pdf English , 12/01/2016
- 001-48723.pdf English , 03/06/2012
- AN17004 Decoupling Guidelines for the CYS25G0101DX OC-48 SONET Transceiver.pdf English , 08/25/2015
- AN1125 Interfacing the CYS25G0101DX to Differential LVPECL.pdf English , 08/25/2015
