BGA7H1N6

Silicon Germanium Low Noise Amplifier for LTE

ParametricBGA7H1N6
Frequency2300 - 2690
Gain12.5dB
P-1dB (in)-1
I4.7mA
NF0.6dB
Budgetary Price €€/1k0.29
Sales Product NameBGA7H1N6
OPNBGA7H1N6E6327XTSA1
Product Statusactive and preferred
Package NamePG-TSNP-6
Completely lead freeyes
Halogen freeyes
RoHS compliantyes
Packing Size15000
Packing TypeTAPE & REEL
Moisture Level1
Summary of Features:
  • Insertion power gain: 12.5 dB
  • Low noise figure: 0.60 dB
  • Low current consumption: 4.7 mA
  • Operating frequencies: 2300 - 2690 MHz
  • Supply voltage: 1.5 V to 3.3 V
  • Digital on/off switch (1V logic high level)
  • Ultra small TSNP-6-2 leadless package (footprint: 0.7 x 1.1 mm2)
  • B7HF Silicon Germanium technology
  • RF output internally matched to 50 Ω
  • Only 1 external SMD component necessary
  • 2kV HBM ESD protection (including AI-pin)
  • Pb-free (RoHS compliant) package
Data Sheet
TitleSizeDateVersion
BGA7H1N6,EN1.3 MB21 三月 201403_01
Application Notes
TitleSizeDateVersion
AN349 - BGA7H1N6 Single Band LTE LNA890 KB21 三月 201401_00
Infineon-AN406-AN-v01_00-EN；EN747 KB24 三月 201501_00
Infineon-AN365-AN-v01_00-EN；EN664 KB02 五月 201401_00
Material Content SheetInfo
TitleSizeDateVersion
MCDS_2015-08-04_16-06-27_MA001122092_PG-TSNP-6-2.pdf；EN28 KB07 八月 201501_00
PCB Design Data
TitleSizeDateVersion
PCB Footprints and Symbols - BGA7H1N6 - LTE - 3G LNAs - Mentor - v2.0.zip；EN2 KB22 一月 201601_00
PCB Footprints and Symbols - BGA7H1N6 - LTE LNA Solutions - MWO – v2.0.zip；EN243 KB08 五月 201501_00
PCB Footprints and Symbols - BGA7H1N6 - LTE - 3G LNAs - Cadence - v2.0.zip；EN11 KB22 一月 201601_00
PCB Footprints and Symbols - BGA7H1N6 - LTE - 3G LNAs - Altium - v2.0.zip；EN522 KB22 一月 201601_00
PCB Footprints and Symbols - BGA7H1N6 - LTE - 3G LNAs - Eagle - v2.0.zip；EN2 KB22 一月 201601_00
Evaluation Boards
BoardFamilyDescriptionStatus
EVAL BGA7H1N6RF LNABGA7H1N6on request
EVAL BGA7L1N6RF LNABGA7L1N6on request
Simulation Models
TitleSizeDateVersion
Infineon-BGA7H1N6-Keysight-ADS-Application-Example-SM-v01_00-EN；EN7.2 MB26 十月 201501_00
Infineon-BGA7H1N6 - LTE 3G LNAs - SimModel with symbol and footprint AWR MWO v1.0.zip；EN1.3 MB31 三月 201601_00
Infineon-BGA7H1N6-AWR-MWO-Application-Example-SM-v01_00-EN；EN213 KB26 十月 201501_00
Infineon-MMIC-LNA-Keysight-ADS-Design-Kit-SM-v02_00-EN；EN5.9 MB26 十月 201502_00
Infineon-MMIC-LNA-AWR-MWO-Design-Kit-SM-v02_00-EN；EN6.2 MB11 十二月 201502_00
Simulation Data
TitleSizeDateVersion
Infineon-BGA7H1N6-SD-v01_00-EN；EN137 KB26 十月 201501_00
Package Data
TitleSizeDateVersion
PG-TSNP-6-2 | BGA7H1N6E6327XTSA1；EN536 KB11 四月 201601_00
PCB Design Data
TitleSizeDateVersion
PCB Footprints and Symbols - BGA7H1N6 - LTE - 3G LNAs - Mentor - v2.0.zip；EN2 KB22 一月 201601_00
PCB Footprints and Symbols - BGA7H1N6 - LTE LNA Solutions - MWO – v2.0.zip；EN243 KB08 五月 201501_00
PCB Footprints and Symbols - BGA7H1N6 - LTE - 3G LNAs - Cadence - v2.0.zip；EN11 KB22 一月 201601_00
PCB Footprints and Symbols - BGA7H1N6 - LTE - 3G LNAs - Altium - v2.0.zip；EN522 KB22 一月 201601_00
PCB Footprints and Symbols - BGA7H1N6 - LTE - 3G LNAs - Eagle - v2.0.zip；EN2 KB22 一月 201601_00
EN BGA7H1N6
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