Summary of Features:

• Developed for telecommunication only
• Support FDD and TDD systems (in full duplex or half-duplex mode)
• Support modulation schemes: QPSK, QAM
• Support small cell backhaul (up to 1000m)
• Direct conversion I/Q transceiver
• IF bandwidth 1000MHz
• Differential RF/IF interface for lower loss and better isolation
• Integration of VCO (Voltage Controller Oscillator) signal generation
• PNssb (Phase Noise single side band) < -80dBc/Hz @ 100kHz offset
• Typ. 13dBm linear output power
• 7dB NF (Noise Figure)
• Integrated power detection function
• Integrated thermal sensor
• eWLB (embedded Wafer Level Ball Grid Array) packaged device

Benefits:

• Packaged solution, easy to use and standard SMT flow for mounting on customer system
• Highly integrated RF transceiver requiring no external RF discretes, thereby simplifying the customer design and time-to-market
• Architecture of Direct Conversion Zero IF eases interface to latest modem/BB designs (no external filter)
• A transceiver approach with implemented BIST (B uilt-I n S elf-T est) on the chip to enable RF testing at Infineon production
• Family concept (common architecture, package, pinning) simplifies customer designs due to modular approach