| Parametric | IPG20N04S4L-08 |
|---|
| RDS (on)
(@10V)
max | 8.2mΩ |
|---|
| RDS (on)
max | 8.2mΩ |
|---|
| RDS (on)
(@4.5V)
max | 10.9mΩ |
|---|
| QG | 30.0nC |
|---|
| VDS
max | 40.0V |
|---|
| ID
max | 20.0A |
|---|
| RthJC
max | 2.8K/W |
|---|
| Ptot
max | 54.0W |
|---|
| IDpuls
max | 80.0A |
|---|
| VGS(th)
min
max | 1.2V
2.2V |
|---|
| Sales Product Name | IPG20N04S4L-08 |
|---|
| OPN | IPG20N04S4L08ATMA1 |
|---|
| Product Status | active and preferred |
|---|
| Package Name | PG-TDSON-8 |
|---|
| Completely lead free | no |
|---|
| Halogen free | yes |
|---|
| RoHS compliant | yes |
|---|
| Packing Size | 5000 |
|---|
| Packing Type | TAPE & REEL |
|---|
| Moisture Level | 1 |
|---|
| Summary of Features:- Dual N-channel Logic Level - Enhancement mode
- AEC Q101 qualified
- MSL1 up to 260°C peak reflow
- 175°C operating temperature
- Green Product (RoHS compliant)
- 100% Avalanche tested
Benefits:- Dual Super S08 can replace multiple DPAKs for significant PCB area savings and system level cost reduction.
- Bond wire is 200um for up to 20A current
- Larger source lead frame connection for wire bonding
- Package: PG-TDSON-8-4
- Same thermal and electrical performance as a DPAK with the same die size.
- Exposed pad provides excellent thermal transfer (varies by die size)
- Two N-Channel MOSFETs in one package with 2 isolated lead frames
Target Applications:- Small loads control switching
- Body applications
 |
