P-MCC8-2-6

The P-MCC8-2-6 is an optimized contactless module working as 1:1 replacement for existing modules MCC8-2-3/MOB4: No change in thickness (mold and chip); No change in mold size (4,80 x 5,10mm) ; Optimized for smaller IC; Fully compatible to existing production equipment and settings

ParametricP-MCC8-2-6
Product DescriptionOptimized standard contactless mold module, successor of P-MCC8-2-3
Pitch9.5mm
Dimensions8.1 x 5.15mm
Thicknessmax. 340μm
Contact SurfaceAg
ISO – ReferenceISO 7816-1, ISO 7810, ISO 10373-1/-3
Delivery FormsTape on Reel
ApplicationsPayment, Government Identification, , Transport Ticketing
Product NameP-MCC8-2-6
Summary of Features:
  • 9.5mm
  • 8.1 x 5.15mm
  • max. 340μm
  • Ag
  • ISO 7816-1, ISO 7810, ISO 10373-1/-3
  • Tape on Reel
Target Applications:
  • Payment,
  • Government Identification,
  • e-Passport,
  • Basic ID,
  • Driver License,
  • Healthcare,
  • Transport
Application Brochure
TitleSizeDateVersion
Security for the connected worldEN1.5 MB18 二月 201602_16
Product Selection Guide
TitleSizeDateVersion
Infineon Chip Card & Security ICs PortfolioEN2.1 MB03 十一月 201511_15
EN S-COM86
EN S-COM86