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P-MCS8-2-1

The P-MCS8-2-1 is a economical thin module (< 250µm) allowing: integration of additional security layer, possibility of very thin inlays, additional layer to reduce card cracks, higher card quality (more coverage over chip). It uses the proven lead frame design from the P-MCC8-2-6. With its standard dimensions and due to its compatible design existing sets of production settings e.g. for thermo compression can be used and allow a easy change over.

Parametric P-MCS8-2-1 Product Description Thin contactless mold module Pitch 9.5mm Dimensions 8.1 x 5.15mm Thickness max. 250µm Contact Surface Ag ISO – Reference ISO 7816-1, ISO 7810, ISO 10373-1/-3 Delivery Forms Tape on Reel Applications Payment, Government Identification Product Name P-MCS8-2-1

Summary of Features: 9.5mm 8.1 x 5.15mm max. 250µm Ag ISO 7816-1, ISO 7810, ISO 10373-1/-3 Tape on Reel Target Applications: Payment, Government Identification, Authentication, Driver Licence, Healthcare, ID, Transport

Application Brochure

Product Selection Guide