S-MID4.8

8 PIN contact based module - dedicated for 10 years life time applications - reduced chip thickness giving new flexibility in card construction - Superior tape material for highest robustness - based on proven FlipChip-Technology

ParametricS-MID4.8
Product DescriptionContact based module for highly demanding applications
Pitch14.25mm
Dimensions13 x 11.8mm
Thicknessmax. 420µm
Contact SurfaceAu
ISO – ReferenceISO 7816-1, ISO 7810
DerivativesPd surface
Delivery FormsTape on Reel
ApplicationsHealthcare, Government Identification, Authentication
Application Brochure
TitleSizeDateVersion
Security for the connected worldEN1.5 MB18 二月 201602_16
Product Selection Guide
TitleSizeDateVersion
Infineon Chip Card & Security ICs PortfolioEN2.1 MB03 十一月 201511_15
EN S-COM86
EN S-COM86