S-MID4.8
8 PIN contact based module - dedicated for 10 years life time applications - reduced chip thickness giving new flexibility in card construction - Superior tape material for highest robustness - based on proven FlipChip-Technology
| Parametric | S-MID4.8 |
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| Product Description | Contact based module for highly demanding applications |
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| Pitch | 14.25mm |
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| Dimensions | 13 x 11.8mm |
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| Thickness | max. 420µm |
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| Contact Surface | Au |
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| ISO – Reference | ISO 7816-1, ISO 7810 |
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| Derivatives | Pd surface |
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| Delivery Forms | Tape on Reel |
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| Applications | Healthcare, Government Identification, Authentication |
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Application Brochure
Product Selection Guide
