| Parametric | SLM 10TLC002L |
|---|
| Product Description | CIPURSE™move |
|---|
| Additional Features | CIPURSE™L profile |
|---|
| EEPROM | 304.0Byte |
|---|
| Interfaces | ISO 14443 A |
|---|
| Interfaces | NFC Forum Type 4 Tag configurable |
|---|
| Certifications | CIPURSE™ |
|---|
| Delivery Forms | MCC8 |
|---|
| Delivery Forms | NiAu-bump |
|---|
| Delivery Forms | Wafer sawn |
|---|
| Applications | Transport Ticketing |
|---|
| Applications | Authentication |
|---|
| Applications | Access Controll |
|---|
| Applications | Micro Payment |
|---|
| Tools | - |
|---|
| Summary of Features:- Chip hardware based on mature CMOS technology
- 17 pF chip input capacitance
- Operation temperature range -25 °C to +70 °C
- Available as sawn, bumped wafer or contactless module MCC8
- ISO/IEC 7816-4 file system
- 304 Byte (2.4 kbit) user memory
- Binary, linear record and value-record files
- One CIPURSE™ application configurable
- One PxSE application configurable
- Up to 3 elementary files per CIPURSE™ application configurable
Target Applications:- Automatic Fare Collection (AFC) system
- Event ticketing
- Access management
- Loyalty and identification
- Micropayment
- NFC
|
