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TLE7239SL

The TLE7239SL is an eight channel high-side and low-side power switch in PG-SSOP-24-5 package providing embedded protective functions. It is especially designed for standard relays and LEDs in automotive applications. The output stages incorporate two low-side, four high-side and two auto configuring high-side or low-side switches. A serial peripheral interface (SPI) is utilized for control and diagnostics of the device and the load. For direct control, there are three input pins available. The TLE7239SL provides a micro controller fail-safe function which is activated via a high signal at the limp home input pin. There is a power supply integrated in the device to ensure this functionality even without digital supply voltage. The integrated power supply is designed to fulfill cranking mode requirements. The power transistors are built by N-channel power MOFSETs. The device is monolithically integrated in Smart Power Technology.

Parametric TLE7239SL Family SPIDER Channels 8.0 RDS (on)    (max) 0.9Ω  (1.9Ω) VDD 3.0 - 5.5 V VDS(CL)  min  max 41.0V  52.0V ID (multiple) 260.0 mA ID(lim)  min 0.5A Quiescent Current  max 10.0µA Configurable Channels 2 PWM Inputs 2.0 Overload shutdown Yes Over Current Protection Shutdown Undervoltage Shutdown Yes Short GND Detection Yes Open Load Detection off Open Load Disable Function Yes Standby Mode Yes Limp Home Feature Yes Cranking mode Yes SPI 8.0Bit Daisy-Chain Capability Yes Operating Temperature  min  max -40.0°C  150.0°C Mounting SMT Sales Product Name TLE7239SL OPN TLE7239SLXUMA1 Product Status not for new design Package Name PG-SSOP-24 Completely lead free yes Halogen free yes RoHS compliant yes Packing Size 2500 Packing Type TAPE & REEL Moisture Level 3

Summary of Features: 8 bit SPI for diagnostics and control, providing daisy chain capability Very wide range for digital supply voltage Two configurable input pins offer complete flexibility for PWM operation Stable behavior at under voltage Green product (RoHS complaint) AEC Qualified Benefits: Less Microcontr.  I/Os needed Protection of load and device Reduced PCB space Improved reliability Less external components Cost savings

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