IGBT 模块

IGBT模块600V/650V
IGBT模块1200V
IGBT模块1600V / 1700V
IGBT模块3300V
IGBT模块4500V / 6500V

我们推出具备优异电气性能和高可靠性的模块概念,模块同时具备非常高的设计灵活性。

Discover a new Dimension of Smart Protection MIPAQ™ Pro MIPAQ™ Pro intelligent power module (IPM) is a fully qualified and tested IPM integrating IGBTs, gate drivers, a heat sink, sensors, digital control electronics as well as digital bus communication. It comes in a half-bridge configuration with blocking voltages of 1200 V and 1700 V.
Application Brochure
TitleSizeDateVersion
Solutions for construction, commercial and agricultural vehicles (CAV)；EN6.7 MB30 七月 2014
Solutions for Industrial Drives；EN2.4 MB27 四月 201609_00
Solutions for Traction Systems；EN1.5 MB27 四月 201608_00
Solutions for Uninterruptible Power Supply (UPS) Systems；EN2.6 MB27 四月 201608_00
Solutions for Solar Energy Systems；EN1.9 MB26 六月 201401_00
Solutions for Wind Energy Systems；EN5.4 MB18 四月 2013
Product Brochure
TitleSizeDateVersion
CoolSiC™ technology；EN2.1 MB09 五月 201601_00
Best-in-class products to meet your application demands；EN1.3 MB27 四月 201608_00
1EDI EiceDRIVER™ Compact 300 mil；EN216 KB09 五月 201601_00
Product Brochure Industrial Gate Driver ICs Overview；EN613 KB27 四月 201603_00
Application Notes
TitleSizeDateVersion
利用单极栅电压驱动IGBT；CN；EN384 KB03 十一月 201501_00
评估板_AN2007_05_2ED300E17_SFO；CN；EN1,023 KB04 十一月 201501_01
Industrial IGBT Modules Explanation of Technical Information；EN；JA2.2 MB03 十二月 201501_02
驱动IC外部放大器；CN；EN1.3 MB03 十一月 201501_06
EiceDRIVER™ - Gate resistor for power devices；EN738 KB17 十二月 201501_00
Evaluation Driver Board for EconoPACK™ 4 3-Level Modules in NPC2-Topology with 1ED020I12-F gate driver IC；EN1 MB21 三月 2014
Evaluation Adapter Board for EconoPACK™ 4 3-Level Modules in NPC2-Topology；EN1.5 MB14 七月 2014
Evaluation Adapter Board for 62mm Half Bridge IGBT Modules；EN969 KB08 十一月 2013
Modules with pre-applied Thermal interface Material；EN393 KB26 一月 201601_01
IHM 和 IHV 模块使用及安装指南；CN；EN2.4 MB09 十二月 2013
62mm Modules Application and Assembly Notes；EN；DE1.5 MB14 三月 2013
Evaluation Adapter Board for EconoPACK™4 650V, 3-Level Modules in NPC2-Topology；EN879 KB30 五月 2012
Evaluation Driver Board for EconoPACK™4 3-Level Modules in NPC2-Topology with 1ED020I12-F gate driver IC；EN1.2 MB21 三月 2014
适配器板驱动板 MA3L080E07_EVAL, EconoPACK4；CN；EN2.3 MB26 八月 2013
驱动板 F3L020E07-F-P_EVAL, EconoPACK4；CN；EN1.5 MB26 八月 2013
MA400E12/17 与 MA401E12/17 – 用于IHM IGBT 模块的模块适配板；CN；EN1.4 MB26 十一月 2013
Evaluation Board for Easy2B 3-Level Modules；EN1.6 MB14 十二月 2010
安装说明 EconoPACK™4 模块；CN；EN；DE1 MB20 八月 2012
MA3AE12_EVAL - Isolating Amplifier for current measurement with MIPAQ™ Base；EN432 KB14 七月 2014
MA040E12_EVAL - Isolated Gate Driver Power Supply and Logic Interface for MIPAQ™ Serve；EN914 KB18 八月 2010
7ED020E12-FI-U1 – 采用2ED020I12-FI 驱动芯片的 Smart PIM1 模块评估板；CN；EN1.7 MB26 十一月 2013
Module Adapter Board for EconoDUAL™3 IGBT Modules；EN1.1 MB14 二月 2010
电力电子模块内部NTC的使用；CN；EN586 KB26 十一月 2013
Assembly Instructions Smart1 Modules；EN；DE1.5 MB22 十月 2009
PrimePACK™ 模块的安装说明；CN；EN645 KB25 十一月 2013
MIPAQ™ serve - Module with adapted driver electronics；EN834 KB16 八月 2013
MIPAQ™ sense - Making use of Modules with integrated Current Measurement；EN386 KB31 八月 2009
MIPAQ™ base - Making use of Modules with integrated Shunts；EN211 KB31 八月 2009
Assembly Instructions - Easy-PressFIT Modules；EN1.5 MB29 四月 201302_02
Evaluation Driver Board for 1200 V PrimePACK™；EN1 MB14 二月 2011
等效热路模型；CN；EN；DE500 KB25 十一月 2013
模块的评估驱动板；CN；EN2.3 MB25 十一月 2013
Application Note IGBT Definition of Junction Temperature；EN84 KB09 四月 2009
Mounting instruction for PressFIT with forked pins；EN；DE675 KB04 十二月 2012
PrimePACK™ IGBT 模块 的适配器板；CN；EN1.6 MB25 十一月 2013
如何正确计算并最大限度减小 IGBT 的死区时间；CN；EN1.5 MB26 八月 2013
Evaluation Board for EasyPIM™2B Modules；EN611 KB14 二月 2011
Mounting Instructions for EasyPIM™ and EasyPACK Modules；EN；DE845 KB29 四月 2013
安装说明 EconoDUAL™3 模块；CN；EN；DE924 KB20 八月 2012
Application of screen print templates to paste thermal grease within IGBT modules；EN489 KB10 二月 2014
Soldering of Econo and Easy Modules；EN194 KB10 二月 2014
Short Circuit Behaviour of IGBT3 600 V；EN245 KB10 二月 2014
E3和T3系列1200V IGBT3 模块的性能差异；CN；EN330 KB25 十一月 2013
EconoPACK™+ 的并联；CN；EN759 KB26 八月 2013
Mounting Instructions for EasyPIM™750 and EasyPACK750 Modules with screw clamps；EN302 KB10 二月 2014
Switching behavior and optimal driving of IGBT3 modules；EN382 KB09 一月 2012
Mounting Instructions EasyPIM™and EasyPACK modules with screw clamps；EN408 KB10 二月 2014
Aging stability of various heatconducting pastes for use with modules without baseplates；EN111 KB10 二月 2014
Short Circuit Operation of 6.5kV IGBTs；EN243 KB10 二月 2014
Simple and reliable connecting system of 62 mm C- Series IGBT Modules to a Power Circuit Board (PCB)；EN111 KB10 二月 2014
EconoPACK+ 模块的装配；CN；EN274 KB25 十一月 2013
Series connection of IGBTs；EN28 KB10 二月 2014
Paralleling of IGBTs；EN28 KB10 二月 2014
Editorials
TitleSizeDateVersion
End-of-life investigation on the .XT interconnect technology；EN908 KB04 十一月 201501_00
New PrimePACK™ package to lever IGBT5；EN344 KB04 十一月 201501_00
A 1000A 6.5kV Power Module Enabled by Reverse-Conducting Trench-IGBT-Technology；EN553 KB04 十一月 201501_00
Electrical performance of a low inductive 3.3kV half bridge IGBT module；EN366 KB04 十一月 201501_00
Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules；EN297 KB04 十一月 201501_00
Control Method for a Reverse Conducting IGBT；EN386 KB04 十一月 201501_00
无铁芯变压器——一项适用于半桥驱动器芯片的新技术；CN；EN395 KB26 八月 201501_00
Performance of power semiconductor devices and the impact on system level；EN521 KB04 十一月 201501_00
New 4.5 kV IGBT and diode chip set for HVDC Transmission Applications；EN818 KB31 五月 2014
Improving Efficiency in AC drives: Comparison of Topologies and Device Technologies；EN892 KB31 五月 2014
Next generation 1700V IGBT and emitter controlled diode with .XT technology；EN921 KB25 八月 2014
SiC-JFET in half-bridge configuration - parasitic turn-on at current commutation；EN1.1 MB31 五月 2014
Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates；EN704 KB31 五月 2014
Saving money: SiC in UPS applications；EN759 KB31 五月 2014
System Benefits for Solar Inverters using SiC Semiconductor Modules；EN676 KB17 七月 2014
Impact of module parasitics on the performance of fast-switching devices；EN3.7 MB31 五月 2014
Switching characteristics of modern 6.5kV IGBT/Diode；EN1.7 MB31 五月 2014
The challenge of accurately analyzing thermal resistances；EN1.1 MB31 五月 2014
Fast switching behavior of IGBTs with high inductive and capacitive loads；EN668 KB11 二月 2014
Application based modified reliability tests and their physical correlation with lifetime assessment models；EN1,017 KB11 二月 2014
Implementation of low inductive strip line concept for symmetric switching in a new high power module；EN734 KB11 二月 2014
Using 650-V High Speed 3 IGBTs in Power Modules for Solar Inverter Performance Improvement；EN1.2 MB11 二月 2014
Simulation vs. measurement of transient thermal resistance Zth of power modules and its effect on lifetime prediction；EN716 KB11 二月 2014
Simulation optimized design for vibration resistant Power module package；EN790 KB11 二月 2014
Next step towards higher power density with new IGBT and diode generation and influence on inverter design；EN1.1 MB11 二月 2014
Superior thermal stability by enhanced base plate design combined with dedicated Thermal Interface Material；EN1.6 MB27 六月 2013
Thermal Interface - A Key Factor in Improving Lifetime in Power Electronics；EN309 KB31 五月 2012
Simple turn-off description of Trench- Field-stop IGBT - IGBT3/3.3kV；EN561 KB31 五月 2012
Optimizing Thermal Interface Material for the Specific Needs of Power Electronics；EN518 KB31 五月 2012
IGBT inverter with increased power density by use of a high-temperature-capable and low-inductance design；EN630 KB31 五月 2012
The Challenging Task of Thermal Management；EN937 KB31 五月 2011
Pushing Power Density Limits using SiC-JFet-based Matrix Converter；EN488 KB31 五月 2011
IGBT with higher operation temperature - Power density, lifetime and impact on inverter design；EN478 KB31 五月 2011
Highly Efficient 12kVA Inverter with Natural Convection Cooling Using SiC Switches；EN586 KB31 五月 2011
EconoPACK™ + A package with enhanced characteristics；EN572 KB31 五月 2011
1st industrialized 1200V SiC JFET module for high energy efficiency applications；EN586 KB31 五月 2011
Self acting PressFIT module；EN624 KB31 一月 2011
New superior assembly technologies for modules with highest power densities；EN1 MB31 一月 2011
New module generation for higher lifetime；EN325 KB31 一月 2011
New assembly and interconnects beyond sintering methods；EN435 KB31 一月 2011
IGBT Module with integrated Current Measurement Unit using Sigma-Delta Conversion for direct Digital Motor Control；EN240 KB31 一月 2011
Cascode light - normally-on JFET stand alone performance in a normally-off Cascode circuit；EN726 KB31 一月 2011
650V IGBT4: The optimized device for large current modules with 10 μs short-circuit withstand time；EN191 KB31 一月 2011
Reliability of Power Modules in Hybrid Vehicles；EN366 KB31 一月 2011
Time Resolved In Situ Tvj Measurements of 6.5kV IGBTs during Inverter Operation；EN545 KB31 一月 2011
Reliability of Substrate Solder Joints from Power Cycling Tests；EN310 KB31 一月 2011
On the loss - softness trade-off: Are different chip versions needed for softness-improvement?；EN731 KB31 一月 2011
IGBT power modules utilizing new 650V IGBT3 and Emitter Controlled Diode3 chips for three level converter；EN325 KB31 一月 2011
IGBT-Module integrated Current and Temperature Sense Features based on Sigma-Delta Converter；EN402 KB31 一月 2011
Efficiency improvement with silicon carbide based power modules；EN275 KB31 一月 2011
6.5kV IGBT and FWD with Trench and VLD Technology for reduced Losses and high dynamic Ruggedness；EN348 KB06 六月 2008
A Progressive Way to Integrate Current Measurement into Modern Power Electronic Systems；EN309 KB06 六月 2008
CIBH Diode with Superior Soft Switching Behavior in 3.3kV Modules for Fast Switching Applications；EN795 KB06 六月 2008
From vehicle drive cycle to reliability testing of Power Modules for hybrid vehicle inverter；EN407 KB06 六月 2008
Higher Junction Temperature in Power Modules；EN1.3 MB06 六月 2008
Numerical investigation on thermal crosstalk of silicon dies in high voltage IGBT；EN495 KB06 六月 2008
Reliability of PressFIT connections；EN472 KB06 六月 2008
Robustness improvement of high-voltage IGBT by gate control；EN1.6 MB06 六月 2008
Benefits of System-oriented IGBT Module Design for High Power Inverters；EN844 KB07 十一月 2007
Numerical and experimental study on surge current limitation of wire-bonded power diodes；EN415 KB08 七月 2008
1200V IGBT4 -High Power- a new Technology Generation with Optimized Characteristics for High Current Modules；EN141 KB07 二月 2014
Thermal Heat Sink Interface of IGBT Modules w/o Base Plate；EN384 KB07 二月 2014
Dynamic Voltage Rise Control, the Most Efficient Way to Control Turn – off Switching Behaviour of IGBT Transistors；EN358 KB07 二月 2014
Research of Current Distribution in IGBT Modules with Multiple Chips in Parallel；EN324 KB07 二月 2014
Properties of a New PrimePACK™ IGBT Module Concept；EN213 KB07 二月 2014
Thermal Properties of Power Terminals in High Power IGBT Modules；EN297 KB07 二月 2014
PressFIT Technology, a Solderless Method for Mounting Power Modules；EN377 KB12 二月 2014
Current Shunt Resistors integrated in IGBT Power Modules for Medium Power Drive Application；EN529 KB07 二月 2014
Repetitive short circuit behaviour of Trench-/Field-Stop IGBTs；EN203 KB07 二月 2014
EiceDRIVER™ - IGBT Driver for medium and high power IGBT Modules；EN331 KB07 二月 2014
The EasyPIM™ / EasyPACK IGBT Module Family for Compact Inverter Design；EN220 KB07 二月 2014
Further Improvements in the Reliability of IGBT Modules；EN60 KB07 二月 2014
„Econo“ my improvement in inverter-converter-moduldesign；EN90 KB07 二月 2014
IGBT Module technology state of the art and future evolutions；EN37 KB07 二月 2014
Product Brief
TitleSizeDateVersion
RCDC - Reverse Conducting IGBT with Diode Control；EN212 KB27 四月 201602_00
PrimePACK™ with IGBT5 and .XT - The Dawning of a New Era；EN283 KB27 四月 201602_00
MIPAQ™ Pro - A New Dimension in Smart Protection；EN188 KB27 四月 201602_00
XHP™ 3 - Flexible high-power platform；EN239 KB27 四月 201602_00
EconoPACK™4 Power Modules；EN106 KB27 四月 201607_00
CoolSiC™ MOSFET. Revolution to rely on.；EN248 KB09 五月 201601_00
34mm & 62mm IGBT 模块；CN；EN253 KB25 十一月 2013
IHM, IHV Modules & PrimePACK™；EN452 KB27 四月 201608_00
Easy & Econo 模块；CN；EN588 KB25 十一月 2013
EasyB-系列模块 与Easy750；CN；EN524 KB25 十一月 2013
EconoDUAL™, EconoPACK™ 4 and EconoPACK™ + Power Modules；EN440 KB27 四月 201607_00
Modules for Photo Voltaic String and Multi-String Inverters；EN476 KB27 四月 201604_00
3-Level Inverter Modules；EN307 KB27 四月 201608_00
SmartPIM and SmartPACK - Self-acting PressFIT assembly；EN168 KB27 四月 201606_00
PressFIT - Our established, reliable mounting technology；EN616 KB27 四月 201608_00
Evaluation and Adapter Boards；EN666 KB27 四月 201608_00
Thermal Interface Material (TIM) - The only Infineon-qualified solution；EN410 KB27 四月 201604_00
Article
TitleSizeDateVersion
Höhere Stromdichten bei unverändertem Bauraum；DE3.2 MB13 十月 201501_00
The Influence of IGBT5 and .XT - Bodos Power；EN537 KB18 五月 201601_00
Enhanced Module Design Makes Most of New IGBT5 Performance；EN367 KB13 十月 201501_00
Infineon-More Power by IGBT5 with .XT-ART-v01_00-EN；EN410 KB06 五月 201501_00
Vervielfachung von Lebensdauer und Leistungsdichte mit IGBT5 & .XT；DE286 KB13 十月 201501_00
Evaluation Boards
BoardFamilyDescriptionStatus
2ED300E17-SFOGate Driver, IGBT ModulesThis evaluation board for the 2ED300C17-S / -ST IGBT driver boards can be used for all medium and high power IGBT modules up to 1700V.For equipping EiceDRIVER™ 2ED300C17-S / -STon request
7ED020E12-FI-U1IGBT ModulesEvaluation Driver Board for SmartPIM 1 Modules up to 1200V. Coreless transformer half-bridge IGBT drivers (2ED020I12-FI) are used for gate control and protection.Equipped with EiceDRIVER™ 2ED020I12-FIFor driving SmartPIM 1 Moduleson request
7ED020E12-FI-W2IGBT ModulesEvaluation Driver Board for EasyPIM™ 2B PressFIT Modules up to 1200V. Coreless transformer halfbridge IGBT drivers (2ED020I12-FI) are used for gate control and protection.Equipped with EiceDRIVER™ 2ED020I12-FIFor driving EasyPIM™ 2B PressFIT Moduleson request
EVAL-1ED020I12-B2Gate Driver, IGBT ModulesEvaluation Board for 1ED020I12-B2 - Galvanic isolated single channel IGBT driver IC with CT technology for 600V/1200V IGBTs.Driving IGBTsFor equipping 1ED 1200V single channel EiceDRIVER™active and preferred
F3L030E07-F-W2IGBT ModulesEvaluation Driver board for 650V Easy2B 3-level modules in NPC1-topology. Coreless transformer IGBT drivers (replaced by 1ED020I12-F2) are used for gate control and protection.Equipped with EiceDRIVER™ 1ED020I12-F2For driving Easy2B 3-level Moduleson request
2ED100E12-F2IGBT ModulesEvaluation Driver Board for EconoDUAL™3 Modules using a coreless transformer single-channel driver (replaced by the EiceDRIVER™ 1ED020I12-F2)Equipped with EiceDRIVER™ 1ED020I12-FFor driving EconoDUAL™3on request
6ED100E12-F2IGBT ModulesEvaluation Driver board for EconoPACK™+ IGBT modules, using a coreless transformer single-channel driver (replaced by 1ED020I12-F2).Equipped with EiceDRIVER™ 1ED020I12-FFor driving EconoPACK™+ IGBT Moduleson request
F3L020E07-F-PIGBT ModulesEvaluation Driver board for 650V 3-level EconoPACK™ 4 modules in NPC1-topology. Coreless transformer IGBT drivers (replaced by 1ED020I12-F2) are used for gate control and protection.Equipped with EiceDRIVER™ 1ED020I12-F2For driving 650V EconoPACK™ 4 3-level IGBT Modules (NPC1)on request
MA070E17IGBT ModulesEvaluation Adapter board with booster stage for 62mm modules up to 1700V.For connecting 1700V 62mm Modules and driver boardson request
MA200E12IGBT ModulesEvaluation Adapter board with booster stage for 1200V EconoDUAL™ 3 modules.For connecting 1200V EconoDUAL™ 3 Modules and driver boardson request
MA200E17IGBT ModulesEvaluation Adapter board with booster stage for 1700V EconoDUAL™ 3 modules.For connecting 1700V EconoDUAL™ 3 Modules and driver boardson request
MA3L080E07IGBT ModulesEvaluation Adapter Board with booster stage for EconoPACK™ 4 3-Level Modules in NPC1-Topology (650V)For connecting 650V EconoPACK™ 4 IGBT Modules (NPC1) and Driver boardson request
MA400E12IGBT ModulesAdapter board with booster stage for 1200V IHM modules (130mm x 140mm). The IGBT module is to be ordered separately.For connecting 1200V IHM IGBT Modules and driver boardson request
MA400E17IGBT ModulesEvaluation Adapter board with booster stage for IHM modules up to 1700V (130mm x 140mm).For connecting 1700V IHM IGBT Modules and driver boardson request
MA401E12IGBT ModulesEvaluation Adapter Board with booster stage for IHM IGBT Modules up to 1200V (140mm x 190mm).For connecting 1200V IHM IGBT Modules and driver boardson request
MA401E17IGBT ModulesEvaluation Adapter Board with booster stage for IHM IGBT Modules up to 1700V (140mm x 190mm).For connecting 1700V IHM IGBT Modules and driver boardson request
MA3L120E12_EVALIGBT ModulesEvaluation Adapter board with booster stage for 1200V EconoPACK™ 4 3-Level Modules in NPC2-Topology.For connecting 1200V EconoPACK™ 4 IGBT Modules (NPC2) and Driver boardson request
F3L2020E12-F-P_EVALGate Driver, IGBT ModulesEvaluation Driver board for 1200V EconoPACK™ 4 3-Level Modules in NPC2-Topology. Coreless transformer IGBT drivers (replaced by 1ED020I12-F2) are used for gate control and protection.Equipped with EiceDRIVER™ 1ED020I12-F2For driving 1200V 3-level EconoPACK™ 4 modules (NPC2)on request
2ED300C17-SIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
2ED300C17-STIGBT Modules up to 1700VEiceDRIVER™ Safe - Dual channel IGBT gate driver board with reinforced isolationFor driving IGBT modules up to 1700Vactive and preferred
MA300E17IGBT ModulesEvaluation Adapter board containing a booster stage for driving 1700V PrimePACK™ in single or parallel configuration. For connecting 1700V PrimePACK™ IGBT Modules and driver boardson request
MA300E12IGBT ModulesEvaluation Adapter board containing a booster stage for driving 1200V PrimePACK™ in single or parallel configuration. For connecting 1200V PrimePACK™ IGBT Modules and driver boardson request
2ED250E12-FIGBT ModulesEvaluation Driver Board for PrimePACK™ Modules up to 1200V using a coreless transformer single-channel driver (replaced by 1ED020I12-F2).Equipped with EiceDRIVER™ 1ED020I12-FFor driving PrimePACK™ IGBT Moduleson request
MA070E12IGBT ModulesEvaluation Adapter board with booster stage for 62mm modules up to 1200V.For connecting 1200V 62mm Modules and driver boardson request
Simulation Models
TitleSizeDateVersion
IPOSIM；EN3.4 MB18 三月 2014
EN XMC4500-E144X1024+AC
EN IFS75B12N3E4_B32
EN 2ED300C17-ST
EN IFS75B12N3E4_B32
EN IDW40E65D2
EN IFS75B12N3E4_B32
EN IDW40G120C5B
EN IFS75B12N3E4_B32
EN 1EDI60I12AH
EN 2EDN7524G
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
CN 2ED300C17-ST
EN 2ED300C17-ST
EN IFS75B12N3E4_B32
JA IFS75B12N3E4_B32
CN 6EDL04N06PT
EN 6EDL04N06PT
EN igbt-module
EN MA3L120E12_EVAL
EN MA3L120E12_EVAL
EN 2ED300E17-SFO
EN FF1400R17IP4P
CN DD250S65K3
EN DD250S65K3
EN 2PS06012S42G28187
DE 2PS06012S42G28187
EN MA3L120E07
EN F3L2020E07-F-P
CN MA3L080E07
EN MA3L080E07
CN MA3L080E07
EN MA3L120E07
CN MA401E17
EN MA401E17
EN F3L030E07-F-W2
CN FS100R17PE4
EN FS100R17PE4
DE FS100R17PE4
EN IFS75B12N3E4_B32
EN IFS100V12PT4
CN 7ED020E12-FI-U1
EN 7ED020E12-FI-U1
EN 2ED300E17-SFO
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN FS35R12U1T4
DE FS35R12U1T4
CN FF1400R17IP4
EN FF1400R17IP4
EN IFS100V12PT4
EN igbt-module
EN IFS75B12N3E4_B32
EN FS50R07W1E3_B11A
EN 2ED250E12-F
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
DE IFS75B12N3E4_B32
CN 6ED100E12-F2
EN 1ED020I12-F2
EN IFS75B12N3E4_B32
EN TDB6HK180N16RR_B11
DE TDB6HK180N16RR_B11
CN FF1400R17IP4
EN 2ED300E17-SFO
CN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN 2ED020I06-FI
EN FS10R12VT3
DE FS25R12W1T4
CN FF150R17ME3G
EN FF150R17ME3G
DE FF150R17ME3G
EN TDB6HK360N16P
EN TDB6HK360N16P
EN igbt-module
CN FZ250R65KE3
EN FZ250R65KE3
CN FS150R12KE3G
EN FS150R17KE3G
EN FS10R12VT3
EN igbt-module
EN FF75R12YT3
EN IFS75B12N3E4_B32
EN igbt-module
EN 2PS06012S42G28187
CN FS150R17KE3G
EN FS150R17KE3G
EN IFS75B12N3E4_B32
EN IFS75B12N3E4_B32
EN FF1800R17IP5
EN FF1800R17IP5
EN igbt-module
EN FF450R33TE3
EN DD250S65K3
EN igbt-module
CN 2ED020I06-FI
EN 2ED020I12-FI
EN 650v-thinq-tm-sic-diode-generation-5
EN FZ750R65KE3
EN FF225R12ME4_B11
EN igbt-module
EN sic-modules
EN BYM600A170DN2
EN sic-modules
EN sic-modules
EN FS3L25R12W2H3_B11
EN DD250S65K3
EN DD250S65K3
EN igbt-module
EN igbt-module
EN igbt-module
EN F4-75R07W2H3_B51
EN igbt-module
EN igbt-module
EN igbt-module
EN igbt-module
EN igbt-module
EN DD500S33HE3
EN igbt-module
EN igbt-module
EN igbt-module
EN igbt-module
EN igbt-module
EN igbt-module
EN FS150R17KE3G
EN sic-modules
EN FS35R12U1T4
EN FF600R17ME4_B11
EN igbt-module
EN igbt-module
EN igbt-module
EN igbt-module
EN FS50R07U1E4
EN FS200R07A1E3
EN FZ250R65KE3
EN igbt-module
EN FP75R17N3E4
EN F3L75R07W2E3_B11
EN IFS75B12N3E4_B32
EN FF600R12IS4F
EN DD250S65K3
EN IFS75B12N3E4_B32
EN DD500S33HE3
EN FS600R07A2E3
EN FS200R07A1E3
EN igbt-module
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