HCS360
The HCS360 is a code hopping encoder designed for secure Remote Keyless Entry (RKE) systems. The HCS360 utilizes Microchip’s patented KEELOQ® hopping technology, which incorporates high security, a small package outline, and low cost, to make this device a perfect solution for unidirectional remote keyless entry systems and access control systems. The HCS360 combines a 32-bit hopping code generated by a non-linear encryption algorithm, with a 28/32-bit serial number and 7/3 status bits to create a 67-bit transmission stream. The length of the transmission eliminates the threat of code scanning and the code hopping mechanism makes each transmission unique, thus rendering code capture and re-send (code grabbing) schemes useless. The encoder key, serial number, and configuration data are stored in EEPROM, which is not accessible via any external connection. This makes the HCS360 a very secure unit. The HCS360 provides an easy-to-use serial interface for programming the necessary security keys, system parameters, and configuration data. The HCS360 operates over a wide voltage range of 2.0V to 6.6V and has four button inputs in an 8-pin configuration. This allows the system designer the freedom to utilize up to 15 functions. Additional features include an IR Mode, PWM and Manchester Encoding, 2 independent counters and 2-bit CRC.
| 技术参数|
Parameter Name
Value
| Value | |
Device Description
KEELOQ® Encoder Devices
|
KEELOQ® Encoder Devices
| |
Operating Voltage (V)
2.0 to 6.3
|
2.0 to 6.3
| |
Function Codes
15
|
15
| |
Transmission Code Length Bits
67
|
67
| |
Code Hoppings Bits
32
|
32
| |
Features
2 independent counters
|
2 independent counters
| |
Encryption Key Length
64
|
64
| |
Seed Length
48
|
48
|
|
文档资料
订购型号
| Part Number | Leads | Package Type | Temp Range | Packing | 1+ | 26+ | 100+ | 1000+ | 5000+ |
|---|
| HCS360-I/P | 8 | PDIP | -40C to +85C | TUBE | 1.51 | 1.45 | 1.39 | 1.28 | 1.23 |
| HCS360-I/SN | 8 | SOIC | -40C to +85C | TUBE | 1.51 | 1.45 | 1.39 | 1.28 | 1.23 |
| HCS360T-I/SN | 8 | SOIC | -40C to +85C | T/R | 1.60 | 1.54 | 1.48 | 1.36 | 1.30 |
相关开发工具
器件无铅环保信息
| PartNumber | DeviceWeight | ShippingWeight | LeadCount | PackageType | PackageWidth | SolderComposition | JEDECIndicator | RoHS | ChinaEFUP |
|---|
| HCS360/P | 0.486700 | 0.900000 | 8 | PDIP | .300in | Matte Tin | e3 |  |  |
| HCS360-I/P | 0.486700 | 0.900000 | 8 | PDIP | .300in | Matte Tin | e3 | | |
| HCS360-I/SN | 0.078000 | 0.160000 | 8 | SOIC | .150In(3.90mm) | Matte Tin | e3 | | |
| HCS360T/SN | 0.078000 | 0.230303 | 8 | SOIC | .150In(3.90mm) | Matte Tin | e3 | | |
| HCS360T-I/SN | 0.078000 | 0.230303 | 8 | SOIC | .150In(3.90mm) | Matte Tin | e3 | | |
| HCS360/SN | 0.078000 | 0.160000 | 8 | SOIC | .150In(3.90mm) | Matte Tin | e3 | | |
