IS2025

The IS2025 stereo audio chip is a compact, highly integrated, CMOS single-chip RF and baseband IC for Bluetooth v4.1 + EDR 2.4GHz applications.  This chip is fully compliant with Bluetooth specifications and is completely backward-compatible with Bluetooth 3.0, 2.0 or 1.2 systems.  It incorporates Bluetooth 1M/2M/3Mbps RF, single-cycle 8bit MCU, TX/RX modem, 5-port memory controller, task/hopping controller, UART interface, and Microchip’s own Bluetooth software stack to achieve the required BT v4.1 with EDR functions.

For delivering superior audio and voice quality, it also integrates a DSP co-processor, a PLL, and a CODEC dedicated for voice and audio applications.  For voice, not only basic CVSD encoding and decoding but also enhanced noise reduction and echo cancellation are implemented by the built-in DSP to achieve better quality in both sending and receiving sides. For the enhanced audio applications, SBC/AAC_LC decoding functions can be also carried out by DSP to satisfy Bluetooth A2DP requirements.

In addition, to minimize the external components required for portable devices, a battery voltage sensor, battery charger, a switching regulator and LDO are integrated to reduce system BOM cost for various Bluetooth applications.  As the market of portable/wireless speakers demand is increasing, a stereo 2 channels 2.3W class-D amplifier which provides up to 100dB SNR is also built-in to reduce BOM cost and PCB area.

产品特性
  • Compliant with Bluetooth Specification v.4.1 (EDR) in 2.4 GHz ISM band
  • Supports the following profiles: HFP 1.6 HSP 1.1 A2DP 1.2 AVRCP 1.5 SPP 1.0 PBAP 1.0
  • HFP 1.6
  • HSP 1.1
  • A2DP 1.2
  • AVRCP 1.5
  • SPP 1.0
  • PBAP 1.0
  • 16MHz main clock input
  • Built-in internal ROM for program memory
  • Support to connect to two hosts ( phones, tablets…) with HFP or A2DP profiles simultaneously
  • Adaptive Frequency Hopping (AFH) avoids occupied RF channels
  • Fast Connection supported
  • Fully-certified Bluetooth 4.1 (EDR) system in 2.4 GHz ISM band
  • Combined TX/RX RF terminal simplifies external matching and reduces external antenna switches
  • Max. +4dBm output power with 20 dB level control from register control
  • Built-in T/R switch for Class 2/3 application
  • To avoid temperature variation, temperature sensor with temperature calibration is utilized into bias current and gain control
  • Fully integrated synthesizer has been created. There requires no external VCO, varactor diode, resonator and loop filter
  • Crystal oscillation with built-in digital trimming for temperature/process variations
  • Noise suppression
  • Echo suppression
  • SBC and optional AAC decoding
  • Packet loss concealment
  • Built-in four languages (Chinese/ English/ Spanish/ French) voice prompts and 20 events for each one
  • 20 bit DAC and 16 bit ADC codec
  • 98dB SNR DAC playback
  • Built-in 2 channel 2.3W class-D amplifier for a 4Ω speaker
  • Built-in Lithium-ion battery charger (up to 350mA)
  • Integrate 3V, 1.8V configurable switching regulator and LDO
  • Built-in ADC for battery monitor and voltage sense.
  • A line-in port for external audio input
  • Two LED drivers
  • High speed HCI-UART (Universal Asynchronous Receiver Transmitter) interface (up to 921600bps)
  • 8 x 8 mm2 68QFN package
技术参数
Parameter Name Value Value
Bluetooth Classic-Data/SPP Yes Yes
Bluetooth Classic-Audio Yes Yes
Audio Channels Stereo Stereo
Analog Audio Out Yes Yes
MIC-in 2 2
Line-in Yes Yes
I2C 1 1
TX Power +4dBm +4dBm
GPIO 10 10
Pin Count 68 68
Package Type QFN QFN
Package Size 8 x 8 mm 8 x 8 mm
Min Temp Range -20C -20C
Max Temp Range 70C 70C
Op Voltage Min 3.0V 3.0V
Op Voltage Max 4.25V 4.25V
文档资料
IS202x DatasheetData Sheets07/13/20152730KB
器件无铅环保信息
PartNumberDeviceWeightShippingWeightLeadCountPackageTypePackageWidthSolderCompositionJEDECIndicatorRoHSChinaEFUP
IS2025S-2030.33400068VQFN8x8x0.9mmMatte Tine3
IS2025S-203-TRAY0.86538568VQFN8x8x0.9mmMatte Tine3
IS2025S-0020.33400068VQFN8x8x0.9mmMatte Tine3
IS2025S-002-TRAY0.86538568VQFN8x8x0.9mmMatte Tine3
IS202x Datasheet IS2025