The LAN88730 is a high-performance, low-power 10/100 Ethernet controller which incorporates the essential protocol requirements for operating an IEEE 802.3 10BASE-T and 802.3u 100BASE-TX compliant Ethernet node. It is specifically designed to meet the high reliability standards required by automotive applications, including on-board diagnostics and fast software download interfaces for central gateway and telematics modules, navigation systems, radio head units and connectivity devices. The LAN88730 offers increased access speed for diagnostics and software downloads when compared with the more traditional, slower speed interfaces that are typically used.
The LAN88730 provides a simple, digital interface via MII (IEEE 802.3u) to a standard MAC layer integrated in an embedded microcontroller. When built into an embedded device within the car, the chip can function as a network branch to the outside world, connecting the car to a personal computer, diagnostic tool or a complex Ethernet network in the repair shop.
The LAN88730 can be configured for either 10 or 100 Mbps Ethernet operation in full and half-duplex mode. To determine the best possible speed and duplex mode of operation, it automatically implements Auto-Negotiation.
HP Auto-MDIX is also supported and provides detection and correction of both direct connection and crossed Ethernet cabling.
产品特性
| 技术参数
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LAN88730 - Small Footprint MII/RMII 10/100 Ethernet Transceiver | Data Sheets | 09/08/2015 | 844KB | |
AN2157 - Transient Protection in Power Over Ethernet Applications | AppNote | 05/24/2016 | 229KB | |
LAN88730 Sell Sheet | Brochures | 12/18/2013 | 673KB | |
LAN88730 IBIS Model lan88730.ibs | IBIS | 01/07/2015 | 639KB | |
Design Guide, Ethernet Front End (Generic) | Software Library | 08/24/2013 | 1KB | |
Design Guide, General ESD Guidelines | Software Library | 08/24/2013 | 1KB | |
Design Guide, General PCB Design Guidelines | Software Library | 08/24/2013 | 1KB | |
Schematic Design Guide, Xtal Load Capacitance Calculation | Software Library | 08/24/2013 | 1KB | |
Component Placement Checklist, LAN88730, 32-pin QFN Package | Design Checklist | 08/24/2013 | 1KB | |
LAN88730 32-pin QFN Package Component Placement Checklist | Design Checklist | 03/30/2012 | 162KB | |
LAN88730 32-pin QFN Package Routing Checklist | Design Checklist | 03/30/2012 | 281KB | |
LAN88730 QFN Rev B Schematic Checklist | Design Checklist | 12/19/2012 | 170KB | |
LAN88730 Routing Checklist | Design Checklist | 08/24/2013 | 1KB | |
LAN88730 Schematic Checklist | Design Checklist | 08/24/2013 | 1KB |
PartNumber | DeviceWeight | ShippingWeight | LeadCount | PackageType | PackageWidth | SolderComposition | JEDECIndicator | RoHS | ChinaEFUP |
---|---|---|---|---|---|---|---|---|---|
LAN88730AM-C | 0.063600 | 0.734694 | 32 | VQFN | 5x5x0.9mm | Matte Tin | e3 | ||
LAN88730BM-C | 0.063600 | 0.734694 | 32 | VQFN | 5x5x0.9mm | Matte Tin | e3 | ||
LAN88730AMR-C | 0.063600 | 0.138000 | 32 | VQFN | 5x5x0.9mm | Matte Tin | e3 | ||
LAN88730BMR-C | 0.063600 | 0.138000 | 32 | VQFN | 5x5x0.9mm | Matte Tin | e3 | ||
LAN88730AM-C-V01 | 0.063600 | 0.734694 | 32 | VQFN | 5x5x0.9mm | Matte Tin | e3 | ||
LAN88730AMR-C-V01 | 0.063600 | 0.138000 | 32 | VQFN | 5x5x0.9mm | Matte Tin | e3 | ||
LAN88730BM-C-V01 | 0.063600 | 0.734694 | 32 | VQFN | 5x5x0.9mm | Matte Tin | e3 | ||
LAN88730BMR-C-V01 | 0.063600 | 0.138000 | 32 | VQFN | 5x5x0.9mm | Matte Tin | e3 |