MCP2155 _ BDTIC 中国领先电子元器件代理商

MCP2155

MCP2155 provided IrDA protocol handling PLUS bit encoding/decoding functionality for Data Communication Equipment (DCE) applications in one low pincount device

技术参数

Parameter Name Value	Value
Operating Temperature Range (°C) -40°C to +85°C	-40°C to +85°C
Xmit/Rec Formats supported (µS) 1.63	1.63
Max. Baud Rate 115200.0	115200.0
Operating Voltage (V) 3.0 - 5.5	3.0 - 5.5
Device Description IrDA Protocol Stack handler plus bit encoding/decoding for DCE applications	IrDA Protocol Stack handler plus bit encoding/decoding for DCE applications

文档资料

MCP2155 Datasheet	Data Sheets	02/05/2013	830KB
MCP215X Rev. A Silicon/Data Sheet Errata	Errata	02/23/2006	141KB
MCP215X Rev. B Silicon/Data Sheet Errata	Errata	02/23/2006	138KB
MCP215X Rev. C Silicon/Data Sheet Errata	Errata	08/15/2006	134KB
AN243 - Fundamentals of the Infrared Physical Layer	AppNote	01/19/2004	307KB
AN758 - Using the MCP2150 To Add IrDA® Standard Wireless Connectivity	AppNote	06/04/2001	363KB
AN858 - Interfacing The MCP215X to a Host Controller	AppNote	10/25/2002	428KB
AN888 - Programming the Palm OS™ for Embedded IR Applications	AppNote	01/08/2004	627KB
AN923 - Using the MCP2120 Developer's Board of "IR Sniffing"	AppNote	04/20/2004	424KB
AN926 - Programming the Pocket PC OS for Embedded IR Applications	AppNote	02/09/2009	825KB
AN927 - Data Throughput and the MCP215X	AppNote	07/25/2006	518KB
AN941 - Programming Windows XP® for Embedded IR Applications	AppNote	06/07/2007	1342KB
TB046 - Connecting the MCP2150 To The Psion Operating System	AppNote	07/25/2006	720KB
TB047 - Connecting the MCP2150 To The Windows CE® Operating System	AppNote	07/25/2006	218KB
TB048 - Connecting the MCP2150 to the Windows® Operating System	AppNote	07/25/2006	188KB
TB049 - Connecting the MCP2150 to the Palm? Operating System	AppNote	07/25/2006	193KB
TB059 - Using The MCP2150 Developer's Board With The MCP2155	AppNote	05/06/2004	380KB
TB073 - Selecting an MCP21XX Device for IrDA® Applications	AppNote	08/12/2004	124KB
Analog & Interface Guide (Volume 2)	Brochures	10/11/2005	1067KB
Quick Guide to Microchip Development Tools	Brochures	10/15/2014	11223KB
ADN006 Wireless Communication Using the IrDA® Standard Protocol	Design Notes	05/06/2004	130KB
Analog & Interface Product Selector Guide	Product Line Card	03/21/2016	4116KB
MCP2150 Developer's Board User's Guide	User Guides	01/07/2010	1550KB
MCP215X Data Logger Demo Board User's Guide	User Guides	11/10/2004	967KB

订购型号

Part Number	Leads	Package Type	Temp Range	Packing	1+	26+	100+	1000+	5000+
MCP2155-I/P	18	PDIP	-40C to +85C	TUBE	4.02	3.35	3.05	2.94	2.91
MCP2155-I/SO	18	SOIC	-40C to +85C	TUBE	4.02	3.35	3.05	2.94	2.91
MCP2155-I/SS	20	SSOP	-40C to +85C	TUBE	4.02	3.35	3.05	2.94	2.91
MCP2155T-I/SO	18	SOIC	-40C to +85C	T/R	4.02	3.35	3.05	2.94	2.91
MCP2155T-I/SS	20	SSOP	-40C to +85C	T/R	4.02	3.35	3.05	2.94	2.91

器件无铅环保信息

PartNumber	DeviceWeight	ShippingWeight	LeadCount	PackageType	PackageWidth	SolderComposition	JEDECIndicator
MCP2155-I/P	1.248000	2.200000	18	PDIP	.300in	Matte Tin	e3
MCP2155-I/PRVB	1.248000	2.200000	18	PDIP	.300in	Matte Tin	e3
MCP2155-I/SO	0.481000	0.857143	18	SOIC	.300in	Matte Tin	e3
MCP2155-I/SORVB	0.481000	0.857143	18	SOIC	.300in	Matte Tin	e3
MCP2155T-I/SO	0.481000	1.000909	18	SOIC	.300in	Matte Tin	e3
MCP2155T-I/SORVB	0.481000	1.000909	18	SOIC	.300in	Matte Tin	e3
MCP2155T-I/SS	0.164200	0.416250	20	SSOP	.209in	Matte Tin	e3
MCP2155T-I/SSG	0.164200	0.476875	20	SSOP	.209in	Matte Tin	e3
MCP2155-I/SS	0.164200	0.343284	20	SSOP	.209in	Matte Tin	e3
MCP2155T-I/SSRVB	0.164200	0.416250	20	SSOP	.209in	Matte Tin	e3
MCP2155-I/SSRVB	0.164200	0.343284	20	SSOP	.209in	Matte Tin	e3