1PS66SB17: 4 V、30 mA低C_d肖特基势垒二极管

平面低电容肖特基势垒二极管封包在极小的SMD塑料封装中。

1PS66SB17: 产品结构框图
1PS66SB17: 应用结构框图
1PS66SB17: 应用结构框图
1PS66SB17: 应用结构框图
SOT666
数据手册 (1)
名称/描述Modified Date
4 V, 30 mA low C_d Schottky barrier diode (REV 6.0) PDF (50.0 kB) 1PSXSB17 [English]04 Apr 2005
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 6 leads (REV 1.0) PDF (188.0 kB) SOT666 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT666_115 [English]29 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
1PS66SB17 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) 1PS66SB17 [English]31 Jan 2015
1PS66SB17 NXP Product Quality (REV 1.2) PDF (74.0 kB) 1PS66SB17_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)IF (A)IR [max] (µA)ConfigurationVF [max] (mV)IFSM [max] (A)Cd [max] (pF)IR [max] (mA)VR [max] (V)IF [max] (mA)VR (V)
1PS66SB17ActiveSOT666SOT6661.6 x 1.2 x 0.55triple isolated450@IF=1mA1@VR=0V0.25@VR=3V430
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
1PS66SB17SOT666Reflow_Soldering_ProfileReel 7" Q1/T1Active1PS66SB17,115 (9340 587 43115)N21PS66SB17Always Pb-free157.00.731.37E911
4 V, 30 mA low C_d Schottky barrier diode 1PS79SB17
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
1PS66SB17 NXP® Product Reliability 1PS66SB17
1PS66SB17 NXP Product Quality 1PS66SB17
1PS66SB17 SPICE model 1PSXSB17
plastic surface-mounted package; 6 leads BSS84AKV
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKV
1PSXSB17
1PSXSB17
1PSXSB17
1PSXSB17