1PS74SB23: 肖特基势垒二极管

平面肖特基势垒二极管采用小型SC-74 (SOT457) SMD塑料封装。

1PS74SB23: 产品结构框图
SOT457
数据手册 (1)
名称/描述Modified Date
Schottky barrier diode (REV 3.0) PDF (54.0 kB) 1PS74SB23 [English]04 Aug 2003
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English]08 Feb 2016
包装 (3)
名称/描述Modified Date
TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 [English]30 Nov 2012
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125 [English]30 Nov 2012
TSOP6; reel pack; reversed product orientation; 12NC ending 165 (REV 1.0) PDF (187.0 kB) SOT457_165 [English]30 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
1PS74SB23 NXP® Product Reliability (REV 1.1) PDF (83.0 kB) 1PS74SB23_1 [English]31 Jan 2015
1PS74SB23 NXP Product Quality (REV 1.2) PDF (74.0 kB) 1PS74SB23_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (3)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English]03 Jun 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)IF (A)IR [max] (µA)ConfigurationVF [max] (mV)IFSM [max] (A)Cd [max] (pF)IR [max] (mA)VR [max] (V)IF [max] (mA)VR (V)
1PS74SB23ActiveSOT457TSOP62.9 x 1.5 x 11single450@IF=1A25100@VR=4V1@VR=25V25
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
1PS74SB23SOT457Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1Active1PS74SB23,115 (9340 549 21115)P11PS74SB23Always Pb-free157.00.731.37E911
Reel 13" Q3/T4 in LargePack, ReverseActive1PS74SB23,165 (9340 549 21165)P11PS74SB23Always Pb-free157.00.731.37E911
Reel 7" Q3/T4, ReverseActive1PS74SB23,125 (9340 549 21125)P11PS74SB23week 22, 2003157.00.731.37E911
Schottky barrier diode 1PS74SB23
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
1PS74SB23 NXP® Product Reliability 1PS74SB23
1PS74SB23 NXP Product Quality 1PS74SB23
MAR_SOT457 Topmark 74LVC2G17_Q100
1PS74SB23 SPICE model 1PS74SB23
plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
TSOP6; reel pack; reversed product orientation; 12NC ending 165 bza456a
Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
1PS74SB23
SSL5021_SSL5031