2PA1774RMB: 40 V，100 mA PNP通用晶体管
PNP通用晶体管，采用无引脚超小型DFN1006B-3 (SOT883B)表面贴装器件(SMD)塑料封装。
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数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 40 V, 100 mA PNP general-purpose transistors (REV 1.0) PDF (327.0 kB) 2PA1774XMB_SER [English] | 26 Mar 2012 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm (REV 1.0) PDF (181.0 kB) SOT883B [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... (REV 1.0) PDF (206.0 kB) SOT883B_315 [English] | 22 Jul 2016 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| 2PA1774RMB NXP® Product Reliability (REV 1.1) PDF (82.0 kB) 2PA1774RMB [English] | 31 Jan 2015 |
| 2PA1774RMB NXP Product Quality (REV 1.2) PDF (74.0 kB) 2PA1774RMB_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- 2PA1774RMB SPICE model (REV 1.4) prm 2PA1774RMB_1 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | Complement | Configuration | IC [max] (mA) | Polarity | Ptot (mW) | Ptot [max] (mW) | VCEO [max] (V) | fT [min] (MHz) | hFE [max] | fr [min] (MHz) | hFE [min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2PA1774RMB | Active | SOT883B | DFN1006B-3 | 1 x 0.6 x 0.37 | 1 | -100 | PNP | 250 | -40 | 390 | 100 | 180 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2PA1774RMB | | SOT883B | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | 2PA1774RMB,315 (9340 658 95315) | 0000 1101 | 2PA1774RMB |    | Always Pb-free | 153.0 | 0.71 | 1.41E9 | 1 | 1 |
- 40 V, 100 mA PNP general-purpose transistors 2PA1774XMB_SERIES
- 2PA1774RMB NXP® Product Reliability 2PA1774XMB_SERIES
- 2PA1774RMB NXP Product Quality 2PA1774XMB_SERIES
- 2PA1774RMB SPICE model 2PA1774XMB_SERIES
- DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm BC857BMB
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... BC857BMB
- PMZB950UPE
