2PA1774xMB series: 40 V,100 mA PNP通用晶体管

PNP通用晶体管,采用无引脚超小型DFN1006B-3 (SOT883B)表面贴装器件(SMD)塑料封装。

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数据手册 (1)
名称/描述Modified Date
40 V, 100 mA PNP general-purpose transistors (REV 1.0) PDF (327.0 kB) 2PA1774XMB_SER [English]26 Mar 2012
封装信息 (1)
名称/描述Modified Date
DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm (REV 1.0) PDF (181.0 kB) SOT883B [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... (REV 1.0) PDF (206.0 kB) SOT883B_315 [English]22 Jul 2016
可靠性与质量信息 (6)
名称/描述Modified Date
2PA1774QMB NXP® Product Reliability (REV 1.1) PDF (82.0 kB) 2PA1774QMB [English]31 Jan 2015
2PA1774QMB NXP Product Quality (REV 1.3) PDF (74.0 kB) 2PA1774QMB_NXP_PRODUCT_QUALITY [English]31 Jan 2015
2PA1774RMB NXP® Product Reliability (REV 1.1) PDF (82.0 kB) 2PA1774RMB [English]31 Jan 2015
2PA1774RMB NXP Product Quality (REV 1.2) PDF (74.0 kB) 2PA1774RMB_NXP_PRODUCT_QUALITY [English]31 Jan 2015
2PA1774SMB NXP® Product Reliability (REV 1.1) PDF (82.0 kB) 2PA1774SMB [English]31 Jan 2015
2PA1774SMB NXP Product Quality (REV 1.2) PDF (74.0 kB) 2PA1774SMB_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态
2PA1774SMBActive
2PA1774RMBActive
2PA1774QMBActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
2PA1774QMBSOT883BReflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActive2PA1774QMB,315 (9340 658 94315)0100 00002PA1774QMBAlways Pb-free153.00.711.41E911
2PA1774RMBSOT883BReflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActive2PA1774RMB,315 (9340 658 95315)0000 11012PA1774RMBAlways Pb-free153.00.711.41E911
2PA1774SMBSOT883BReflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActive2PA1774SMB,315 (9340 658 96315)0000 11102PA1774SMBAlways Pb-free153.00.711.41E911
40 V, 100 mA PNP general-purpose transistors 2PA1774XMB_SERIES
2PA1774QMB NXP® Product Reliability 2PA1774XMB_SERIES
2PA1774QMB NXP Product Quality 2PA1774XMB_SERIES
2PA1774RMB NXP® Product Reliability 2PA1774XMB_SERIES
2PA1774RMB NXP Product Quality 2PA1774XMB_SERIES
2PA1774SMB NXP® Product Reliability 2PA1774XMB_SERIES
2PA1774SMB NXP Product Quality 2PA1774XMB_SERIES
2PA1774QMB SPICE model 2PA1774XMB_SERIES
2PA1774RMB SPICE model 2PA1774XMB_SERIES
2PA1774SMB SPICE model 2PA1774XMB_SERIES
DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm BC857BMB
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... BC857BMB
PMZB950UPE